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Resin composition for sealing semiconductors, and semiconductor device using same

A resin composition and semiconductor technology, which can be applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device parts, etc., and can solve the problems of insufficient balance of continuous formability, adhesion resistance, flame resistance and welding resistance. , to achieve the effect of excellent reliability and excellent solder resistance

Inactive Publication Date: 2012-11-21
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are cases where the balance of continuous moldability, sticking resistance, flame resistance, and soldering resistance is insufficient

Method used

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  • Resin composition for sealing semiconductors, and semiconductor device using same
  • Resin composition for sealing semiconductors, and semiconductor device using same
  • Resin composition for sealing semiconductors, and semiconductor device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0179] The following components were mixed at normal temperature with a mixer, melted and kneaded with a heating roll at 80° C. to 100° C., cooled, and then pulverized to obtain a resin composition.

[0180] Epoxy resin 1 8.83 parts by mass,

[0181] 1 3.67 parts by mass of phenolic resin curing agent,

[0182] Inorganic filler 186.5 parts by mass,

[0183] Curing accelerator 1 0.4 parts by mass,

[0184] Silane coupling agent 1 0.1 parts by mass,

[0185] Silane coupling agent 2 0.05 parts by mass,

[0186] Silane coupling agent 3 0.05 parts by mass,

[0187] 0.3 parts by mass of carbon black,

[0188] 0.1 part by mass of carnauba wax,

[0189] The following items were evaluated about the obtained resin composition. Table 1 shows the evaluation results.

[0190] evaluation item

[0191] Spiral flow: Using a low-pressure transfer molding machine (manufactured by Kohtaki Precision Machine Co., Ltd., KTS-15), under the conditions of 175°C, injection pressure 6.9MPa, and...

Embodiment 2～12

[0199] Embodiment 2~12, comparative example 1~4

[0200] Based on the composition of Table 2, Table 3, and Table 4, it carried out similarly to Example 1, the resin composition for semiconductor sealing was manufactured, and it evaluated similarly to Example 1. The evaluation results are shown in 2, 3 and Table.

[0201] Table 2

[0202]

[0203] table 3

[0204]

[0205] Table 4

[0206]

[0207] Examples 1 to 12 are resin compositions containing epoxy resin (A-1) represented by formula (1), phenolic resin curing agent (B) and inorganic filler (C), including changing the epoxy resin (A-1 - Resin composition with molecular weight distribution of 1), resin composition in which type of phenolic resin (B) was changed, resin composition in which two types of phenolic resin (B) were used in combination, type of curing accelerator (D) was changed Excellent balance of fluidity (spiral flow), continuous moldability, sticking resistance, flame resistance, soldering resista...

Embodiment 13）

[0227] The following components were mixed at normal temperature with a mixer, melted and kneaded under a heating roll at 80° C. to 100° C., cooled, and then pulverized to obtain a resin composition for encapsulating a semiconductor.

[0228]

[0229]

[0230] The obtained resin composition for encapsulating a semiconductor was evaluated for spiral flow, flame resistance, water absorption, continuous moldability, solder resistance, and high-temperature storage characteristics. The evaluation methods of spiral flow, flame resistance, continuous moldability, solder resistance, and high-temperature storage characteristics are as described above. The evaluation results are shown in Table 5.

[0231] Boiling water absorption: Using a low-pressure transfer molding machine (manufactured by Kohtaki Precision Machine Co., Ltd., KTS-30), a disc-shaped test piece with a diameter of 50mm and a thickness of 3mm was tested at a mold temperature of 175°C, an injection pressure of 9.8MP...

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Abstract

Provided is a resin composition for sealing semiconductors which includes an epoxy resin (A), a curing agent (B) and an inorganic filler (C). Therein, the epoxy resin (A) includes an epoxy resin (A-1) represented by formula (1), and the epoxy resin (A-1) includes a component represented by formula (1) wherein n>=1 and a component (a1) represented by formula (1) wherein n=0. (In formula (1), R1 represents a hydrocarbon group with 1-6 carbon atoms, R2 represents a hydrocarbon group with 1-6 carbon atoms or an aromatic hydrocarbon group with 6-14 carbon atoms and can be the same as R1 or different from R1, a is an integer in the range of 0-4, b is an integer in the range of 0-4 and n is an integer not less than zero).

Description

technical field [0001] The present invention relates to a resin composition for semiconductor sealing and a semiconductor device using the same. Background technique [0002] Semiconductor devices are sealed for the purpose of protecting semiconductor elements, ensuring electrical insulation, and facilitating handling. Sealing of semiconductor elements by transfer molding of epoxy resin compositions has become the mainstream because of their excellent productivity, cost, reliability, and the like. In response to market demands for miniaturization, light weight and high performance of electronic equipment, not only the high integration of semiconductor elements, the miniaturization and high density of semiconductor devices, but also the development of a new bonding technology such as surface mounting, so that It is practical. The above-mentioned technological trends also affect resin compositions for encapsulating semiconductors, and the required performance is also increas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/20C08K3/00H01L23/29H01L23/31
CPCH01L2224/45015H01L2224/32245H01L23/293H01L21/565H01L2924/15311H01L2924/10253H01L23/296H01L24/45H01L2224/73265C08K3/0033H01L23/3107H01L2224/32225H01L2224/45144C08G59/3218C08L63/00H01L2224/48247H01L2924/01012C08G59/3236H01L2924/01019H01L2924/01077H01L2224/48227H01L23/3128C08G59/4071H01L24/48H01L23/295H01L2924/01079H01L2924/1301H01L2924/181H01L2224/48091H01L24/73H01L2924/14C08K3/013H01L2924/00H01L2924/00012H01L2924/20752H01L2924/00014C08G59/20C08K3/00H01L23/29
Inventor 田中祐介
Owner SUMITOMO BAKELITE CO LTD
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