Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold

Abstract

The invention discloses a tasteless double-functional material for cleaning and lubricating a semiconductor packaging mold. The double-functional material is prepared from the following raw materials in parts by mass: 100 parts of unvulcanized rubber, 0.1 to 50 parts of cleaning agent, 0.1 to 10 parts of mold-cleaning auxiliary agent, 0.1 to 10 parts of mold-lubricating agent, 0.1 to 10 parts of curing agent and 5 to 100 parts of filling agent. The tasteless double-functional material for cleaning and lubricating the semiconductor packaging mold is harmless and environment-friendly, and can stick a pollutant on the surface of the mold and absorb the pollutant onto the surface of curing rubber. Meanwhile, a mold-lubricating effect is achieved, the production efficiency is improved, the time is saved, and the cost is reduced. The tasteless double-functional material is used without being pre-heated, and a cleaning method is simple and high in efficiency.

Description

technical field [0001] The invention belongs to auxiliary materials in the production of large-scale integrated circuits, and relates to an odorless material for mold cleaning and mold moistening of semiconductor packaging molds. Background technique [0002] Maleic anhydride-phenolic resin (referred to as Melamine resin) is currently used as the traditional clearing material for semiconductor plastic encapsulation molds; the main disadvantages of Melamine resin are: (1) poor operability, and it is necessary to provide products of various sizes for different molds; (2) poor economy , must be used in conjunction with metal copper bracket; (3) poor workability: solidification and decomposition produce formaldehyde and other harmful gases. The rubber-based mold-clearing material that replaces Melamine resin was first invented by Nitto Denko in Japan in the mid-1990s. Later, IC-Vision in Singapore and Nara Chemical in South Korea launched similar products around 2005. [0003] ...

AI Technical Summary

Problems solved by technology

[0002] The current traditional semiconductor plastic packaging mold cleaning material uses maleic anhydride-phenolic resin (Melamine resin for short); the main disadvantages of Melamine resin are: (1) Poor operability, and it is necessary to provide products of various sizes for different molds; (2) Poor economy , must be used in conjunction with metal copper brackets; (3) Poor workability: solidification and decomposition produce harmful gases such as formaldehyde

It takes 1-2 hours to complete the entire cleaning process, which greatly affects the effective machine time of plastic packaging production

There is the characteristic that mold cleaning and mold moistening are completed twice, which causes waste of time and increases costs

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