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Encapsulating structure and encapsulating method for integrating acceleration sensor and magnetic sensor

An acceleration sensor, magnetic sensor technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device components, etc., can solve the problem of wasting PCB board space, reducing product assembly efficiency, increasing product cost, etc., to expand applications, The effect of packaging cost minimization

Active Publication Date: 2015-04-15
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The use of multiple single sensors not only greatly reduces the efficiency of product assembly, but also wastes a lot of space on the PCB board, increases product costs, and limits the popularization and promotion of sensor products

Method used

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  • Encapsulating structure and encapsulating method for integrating acceleration sensor and magnetic sensor
  • Encapsulating structure and encapsulating method for integrating acceleration sensor and magnetic sensor
  • Encapsulating structure and encapsulating method for integrating acceleration sensor and magnetic sensor

Examples

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no. 1 example 100

[0033] See figure 1 As shown, the present invention relates to a first embodiment 100 of a packaging structure integrating acceleration and magnetic sensors, which includes a first wafer 11 and a second wafer 21 .

[0034] Wherein the first wafer 11 is provided with a driving circuit for driving the acceleration sensor and a magnetic sensor and a structural circuit (not shown) of the acceleration sensor, and a first cavity 12 is also provided on the first wafer 11, and in the first cavity 12 A mechanical structure with an acceleration sensor. In addition, the front side of the first wafer 11 is provided with metal pads 13 outside the first cavity 12 .

[0035] The second wafer 21 is bonded on top of the first wafer 11 . A second cavity 22 for matching with the first cavity 12 is opened thereon, and the width of the second cavity 22 along the surface of the wafer is greater than or equal to the size of the mechanical mechanism of the acceleration sensor. The magnetic sensor ...

no. 2 example 200

[0037] Further, such as figure 2 As shown, it illustrates the second embodiment 200 of the packaging structure of the integrated acceleration and magnetic sensor involved in the present invention, its structure is similar to that of the first embodiment, and also includes a first wafer 31 and a second wafer 41 . It differs from the first embodiment in that the metal pad 33 leads out the metal wire 34 in a different way, which is to drill a hole on the first wafer 31 and lead out through a through-silicon via (TSV) process, while the first embodiment The lead out of the pad in the example is realized by the sidewall lead process.

[0038] Further, such as image 3 As shown in -6, the present invention also provides a packaging method for manufacturing the integrated acceleration and magnetic sensor packaging structure involved in the present invention, which includes the following steps:

[0039] 1. First wafer and second wafer preparation and processing (such as image 3 ...

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Abstract

The invention relates to an encapsulating structure and an encapsulating method for integrating an acceleration sensor and a magnetic sensor. The encapsulating structure comprises a first wafer, a second wafer bonded above the front side of the first water, and a magnetic sensor arranged on the second wafer, wherein a drive circuit for driving the acceleration sensor and the magnetic sensor, and a structure circuit of the acceleration sensor are arranged on the first wafer; a first cavity is also arranged on the first wafer; a mechanical structure of the acceleration sensor is arranged inside the first cavity; a second cavity matched with the first cavity is arranged on the second wafer, and the size of the second cavity is greater than or equal to that of the mechanical structure of the acceleration sensor. According to the encapsulating structure and the encapsulating method, a triaxial acceleration sensor and a triaxial magnetic sensor are integrated into the same encapsulating structure; and high integration of a six-axis sensor is achieved, and further integration and development of functions of the sensor are facilitated.

Description

technical field [0001] The invention relates to a sensor packaging structure and method, in particular to a packaging structure and a packaging method for integrating an acceleration sensor and a magnetic sensor. Background technique [0002] With the increasing expansion of the functions of consumer electronics, the application of sensors has gradually become popular, and image sensors, acceleration sensors, magnetic sensors, etc. have become standard configurations of some handheld electronic devices. However, these sensors with different functions often appear in handheld electronic devices as independent products, such as two-axis or three-axis acceleration sensors, two-axis or three-axis magnetic sensors, gyroscopes, etc.; Relatively large, such as acceleration sensor product size is 3x3mm. At present, there are few products in the market that integrate two or more sensors into the same package. Even if there are individual integrated products, they are large-scale pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28
Inventor 陈东敏刘海东段志伟
Owner MEMSIC SEMICON WUXI
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