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Laser beam based micropore machining device and method

A technology of laser beam and micro-hole processing, which is applied in the laser field to achieve the effect of improving cutting speed and efficiency

Inactive Publication Date: 2012-08-22
BEIJING INFORMATION SCI & TECH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The micro-hole processing methods in the prior art (such as mechanical drilling, electric spark drilling, electrochemical drilling, etc.) cannot process such micro-holes with high quality, so it is very urgent to develop a small-diameter and large-depth Microhole Machining Technology

Method used

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  • Laser beam based micropore machining device and method
  • Laser beam based micropore machining device and method
  • Laser beam based micropore machining device and method

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] figure 1 A schematic diagram of the polarization distribution of the radially polarized light beam used in the embodiment of the present invention on the cross section; as figure 1 As shown, on the cross-section of the beam, the polarization state of any point (except the central point) of the radially polarized beam is linearly polarized, and the electric field vector of the radially polarized beam is along the radial direction; the radially polarized ...

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Abstract

The invention relates to a laser beam based micropore machining device and method. The device comprises a radially polarized beam generation unit for converting a laser beam into a radially polarized beam, and emitting the radially polarized beam to a diffractive optical element, the diffractive optical element for modulating the amplitude and phase of the radially polarized beam, and emitting the modulated radially polarized beam to a focusing lens, and the focusing lens for focusing the modulated radially polarized beam, and obtaining a focusing field of the radially polarized beam in the vicinity of a focus of the focusing lens, wherein the intensity distribution of the focusing filed is determined by the structure of the diffractive optical element and the numerical aperture of the focusing lens, and the micropore machining of a material to be machined is carried out by controlling the intensity distribution of the focusing field. The laser beam based micropore machining device provided by the embodiment of the invention can be used for machining the micropores with large depth to diameter ratio and improving the cutting speed and efficiency of the micropores.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a microhole processing device and method based on laser beams. Background technique [0002] In some precision opto-electromechanical systems, it is necessary to process micro-holes with small apertures and large depth-to-diameter ratios. The micro-hole processing methods in the prior art (such as mechanical drilling, electric spark drilling, electrochemical drilling, etc.) cannot process such micro-holes with high quality, so it is very urgent to develop a small-diameter and large-depth Compared with the micro-hole machining technology. Contents of the invention [0003] The purpose of the present invention is to provide a microhole processing device and method based on laser beams, which can realize microhole processing with small aperture and large depth-to-diameter ratio, and simultaneously improve the cutting speed and efficiency of microholes. [0004] An embodiment of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/06B23K26/064B23K26/382
Inventor 周哲海祝连庆杜富荣张晓青王晓玲
Owner BEIJING INFORMATION SCI & TECH UNIV
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