Wafer cassette transfer system and method

Abstract

The embodiment of the invention provides a conveying system of a wafer box. The conveying system comprises a conveying device, at least two contact sensors and a triggering device, wherein the conveying device comprises a clamping part for supporting the wafer box; the at least two contact sensors are positioned on the surface of the clamping part, which is in contact with the wafer box and used for sending contact signals when the clamping part is in contact with the wafer box; and the triggering device is used for receiving the contact signals of the contact sensors and sending a triggering signal to the conveying device after receiving the contact signals of all the contact sensors, Correspondingly, the embodiment of the invention also provides a conveying method of the wafer box. After all the contact sensors send the contact signals to the triggering device, the triggering device sends the triggering signal to the conveying device, and the conveying device begins to move the wafer box after receiving the triggering signal, therefore the conveying reliability of the wafer box is high, and the wafer box is not easy to slip off and not easy to break.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer box delivery system and method. Background technique [0002] The manufacturing process of semiconductor products needs to go through many process steps, and each process step is completed by the corresponding process machine. When a batch of wafers is produced on a process machine, the robotic arm (Arm) of the process machine will put the batch of wafers into the wafer pod (WaferPod), and then the operator will remove the wafer pod from the process machine The wafer box is moved to the storage system, and then the wafer box is transferred to the next process machine through the storage system and the transportation system, and the robotic arm of the next process machine takes the wafer out of the wafer box and transfers it to the process reaction chamber The process reaction is carried out, and the wafer is returned after the process reaction is completed, and th...

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, when the mechanical arm 105 touches the handle 103, it is considered that the mechanical arm 105 has lifted the wafer cassette 101, and the mechanical arm 105 will move

At this time, the wafer cassette 101 may not be completely and horizontally placed on the mechanical arm 105, and there may be figure 2 In the situation shown, the wafer cassette 101 slipped from the mechanical arm and fell to the ground, causing the wafers contained in the wafer cassette 101 to be broken and scrapped, and the reliability of wafer cassette transmission was low

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