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Light source module

A technology of light source modules and phosphors, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as high cost, poor heat dissipation, and limited installation structure

Inactive Publication Date: 2012-01-25
DONGGUAN WANFENG NANOMETER MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Same as the above-mentioned patented technology, the heat dissipation of the aluminum substrate is limited by the installation structure, the thermal interference between adjacent chips is serious, and the actual heat dissipation effect is not good
On the other hand, the use of aluminum substrates to lay out circuits generally can only be done in a single layer, and the cost is very high

Method used

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Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0022] refer to figure 1 , the first embodiment of the present invention is a light source module, including an LED chip 101, and also includes a heat conduction column 102, the heat conduction column 102 is arranged in a plastic shell 108, the heat conduction column 102 has an upper end surface and a lower end surface, and the LED chip 101 Set on the upper end surface of the heat conduction column 102, the plastic shell 108 has an electrode 105, the upper end of the electrode 105 is set close to the LED chip 101, the lower end of the electrode 105 is set on the lower surface of the plastic shell 108, and the LED chip 101 is electrically connected to the upper end of the electrode 105 through a gold wire 104 , the light source module also includes a circuit board 107 and a heat dissipation plate 103, the circuit board 107 has a through hole, the lower end sur...

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Abstract

The invention relates to a semiconductor packaging technology, in particular to a light source module which comprises an LED wafer and also comprises a heat conduction column, wherein the heat conduction column is arranged in a rubber housing and provided with an upper end face and a lower end face, the LED wafer is positioned on the upper end face of the heat conduction column, the rubber housing is provided with an electrode, the upper end of the electrode is arranged close to the LED wafer, the lower end of the electrode is arranged on the lower surface of the rubber housing, and the LED wafer is electrically connected with the upper end of the electrode. The light source module also comprises a circuit board and a heat-radiating board, wherein the circuit board is provided with a through hole, the lower end face of the heat conduction column penetrates through the through hole and is in heat conduction connection with the heat-radiating board, and the lower end of the electrode is electrically connected with the circuit board. The invention provides the light source module with a thermoelectricity separation function.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a light source module. Background technique [0002] LED lights have the characteristics of long life and power saving, and are more and more widely used in the field of lighting. [0003] In the prior art, most of the LED packaging modules adopt the aluminum substrate technology, and the aluminum substrate is not only a circuit board but also a heat dissipation plate. For example, a LED light source module disclosed in Chinese patent document CN201448627U on May 5, 2010, includes an aluminum substrate and a single particle LED chip arranged on the aluminum substrate, and the LED light source module is evenly arranged on the Single-particle LED chips on the aluminum substrate are packaged into a sheet-like whole. The light-transmitting package includes a four-sided plastic frame. The bottom surface of the opening of the four-sided plastic frame is placed on the aluminum sub...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/62H01L33/00
CPCH01L2224/48091H01L2224/73265H01L2924/181
Inventor 李金明
Owner DONGGUAN WANFENG NANOMETER MATERIALS
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