Bracket and camera device with the bracket

Abstract

The invention provides a bracket and an image pickup device with the same. The bracket is arranged on a circuit board and connected with an electronic module; the bracket comprises an upper surface, a lower surface and an opening, wherein the upper surface comprises a lower plane part for a plate shaped module to be placed; the lower plane part comprises at least one rough part; the lower surfacecomprises a convex edge connected with the circuit board by adhesives; a space is defined by the convex edge and the circuit board; the opening penetrates through the upper surface and the lower surface so that the gas generated and accumulated in the space while the adhesives are heated leaves away from the opening and the at least one rough part. According to the invention, the gas generated bythe adhesives is prevented from being accumulated in the bracket and the bracket is floated or inclined; the dust is prevented from falling into the interior of the bracket; no influence is generatedon the mold design of the original bracket; no mold cost of the bracket is increased; and the easy separation between the bracket and the circuit board while the bracket and the circuit are collided or seriously shaken is avoided.

Description

technical field [0001] The invention relates to a bracket and a photographic device with the bracket, in particular to a bracket with air escape and reinforced dispensing design and a photographic device with the bracket. Background technique [0002] In the COB (Chip On Board) process, a holder is often placed on the circuit board (PCB), and electronic components can be placed on the holder. Black glue is usually used as an adhesive between the holder and the circuit board. However, this usually The following disadvantages appear: 1. When the black glue is heated and baked, the black glue will generate gas and accumulate inside the bracket. The gas will cause the bracket to float and cause the bracket to tilt on the circuit board, and even cause the bracket to be easily removed from the circuit board. The circuit board falls off; 2. Even if the bracket does not fall off the circuit board, because the bracket is inclined on the circuit board, it will affect the accuracy of M...

AI Technical Summary

Problems solved by technology

[0002] In the COB (Chip On Board) process, a holder is often placed on the circuit board (PCB), and electronic components can be placed on the holder. Black glue is usually used as an adhesive between the holder and the circuit board. However, this usually The following disadvantages appear: 1. When the black glue is heated and baked, the black glue will generate gas and accumulate inside the bracket. The gas will cause the bracket to float and cause the bracket to tilt on the circuit board, and even cause the bracket to be easily removed from the circuit board. The circuit board falls off; 2. Even if the bracket does not fall off the circuit board, because the bracket is inclined on the circuit board, it will affect the accuracy of MTF (Modulation Transfer Function), thereby affecting the product qualification rate; and 3. The bracket and circuit board The contact surface is extremely small, resulting in insufficient bonding strength of the black glue. When the bracket and the circuit board are hit or severely shaken, the bracket is easy to separate from the circuit board

[0003] In the prior art, in order to solve the shortcoming of gas accumulation, air escape holes (such as China Taiwan Patent No. 388557 or No. I240300) are set up in the bracket, so that the gas can overflow from the inside of the bracket, but this perforation design will cause dust to fall into the inside and the bracket The mold design is not easy to form, which affects the pass rate of the production line and increases the cost of the bracket mold and the unit price of the finished product.

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