Systems and methods for tiered non-volatile storage devices

A technology for non-volatile storage and hard disk storage devices, which is applied in the field of systems implementing storage devices and can solve problems such as large delays

Inactive Publication Date: 2011-11-30
LSI CORP
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method incurs a considerable delay when accessing the hard drive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Systems and methods for tiered non-volatile storage devices
  • Systems and methods for tiered non-volatile storage devices
  • Systems and methods for tiered non-volatile storage devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present invention relates to systems and methods for implementing storage devices, and more particularly, to systems and methods for implementing storage devices with storage layers.

[0026] go to figure 2 , shows a system 200 including a hierarchical non-volatile memory 220 communicatively coupled to a host 210 in accordance with one or more embodiments of the invention. Host 210 may be any device or system capable of transferring data to and from storage devices. Thus, host 210 may be, but is not limited to, a microprocessor, a computer-based system, or an interface circuit as known in the art. Based on the disclosure provided herein, one of ordinary skill in the art will recognize a variety of devices and / or systems that may serve as hosts in accordance with various embodiments of the present invention.

[0027] Hierarchical non-volatile memory 220 includes three memory tiers. Specifically, the hierarchical nonvolatile memory 220 includes: a first layer inclu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Various embodiments of the present invention provide systems and methods for tiered non-volatile storage. As an example, a multi-tiered non-volatile storage device is disclosed that includes a hard disk storage; a solid state, non-volatile storage that caches a subset of data included on the hard disk storage; and a controller circuit that is operable to control data transfer between the solid state, non-volatile storage and the hard disk storage

Description

technical field [0001] The present invention relates to systems and methods for implementing storage devices, and more particularly, to systems and methods for implementing storage devices with storage layers. Background technique [0002] Hard drives are often designed to write data on a sector basis. Thus, for example, writing to a hard drive may involve writing 4096 bytes during a given write transaction illustrated in FIG. 1 . According to FIG. 1 , a data set of 512 bytes is provided by the host computer to be written to the hard drive (step A). In turn, the hard drive retrieves 4096B the data set 120, which includes the address space 130 to be written (step B). The hard drive overwrites this address space with the data to be written 110, and then writes the entire 4096 byte block back to non-volatile memory (step C). This read / modify / write process allows support for mismatches in the size of memory blocks supported by the host and supported by the hard drive. Howeve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/10G06F12/00
CPCG06F2212/224G11B5/012G11B20/10527G11B2220/45G06F12/0866G06F2212/222G11B5/00G11B5/09G11B2020/1062G06F12/0897Y02D10/00G06F12/00G06F13/14G06F13/38
Inventor H·伯格R·W·沃伦杨少华
Owner LSI CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap