Sputtering device and sputtering method
A sputtering, sputtering gas technology, used in sputtering, ion implantation, vacuum evaporation, etc.
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[0028] Embodiment of the invention
[0029] Hereinafter, with reference to the drawings, a sputtering apparatus having a cathode unit in an embodiment of the present invention will be described. Such as figure 1 As shown, the sputtering device M has a vacuum chamber 1 that can form a vacuum gas environment, and the top of the vacuum chamber 1 is equipped with a cathode unit C. In addition, in the following description, the top side of the vacuum chamber 1 is referred to as "upper", and the bottom side thereof is referred to as "lower" for description.
[0030] Such as figure 2 As shown, the cathode unit C has a cylindrical bracket 2 made of a conductive material, for example, the same material as the target material described later. A recess 3 is formed in the center of the lower surface of the bracket 2. The opening area of the recess is set as The target 4 is inserted into the recess 3 within the range of
[0031] The target 4 selects a suitable material according to the com...
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Abstract
Description
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Application Information
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