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Computer motherboard

A motherboard and computer technology, applied in the direction of digital processing power distribution, etc., can solve the problems of wire signal coupling interference, uneven line width, uneven distribution of wire impedance, etc.

Inactive Publication Date: 2011-11-16
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the use of through-hole slots, the wires between the CPU slot and the memory slot farthest away from the CPU slot must pass through the gaps between the through holes of all other memory slots, and pass through The gap space between the holes is limited, so that the wiring of the wires is crowded, causing the signals on the wires to couple and interfere with each other, and may even cause the edges of the wires to appear incomplete and make the line width uneven, resulting in the impedance of the wires Uneven distribution, causing reflections of the signal transmitted on the wire

Method used

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Examples

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Embodiment Construction

[0021] see figure 1 , the preferred embodiment of the computer motherboard of the present invention includes a multi-layer printed circuit board 100 . The printed circuit board 100 includes a CPU socket 10 and a set of memory sockets 20 . The two surface mount sockets 21 and 22 are located between the through-hole socket 23 and the CPU socket 10 .

[0022] see figure 2 and image 3 , the surface mount sockets 21, 22 include a plurality of solder pads, the through hole socket 23 includes a plurality of through holes, and the solder pads of the surface mount sockets 21, 22 are in contact with the through holes The corresponding through-holes of the slots 23 have the same pin definition. In this embodiment, the solder pad 212 of the surface mount socket 21, the solder pad 222 of the surface mount socket 22, and the through hole 232 of the through hole socket 23 with the same pin definition are described as examples. The welding pad 212 of the subsequent type socket 21 is co...

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PUM

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Abstract

The invention relates to a computer motherboard. The computer motherboard comprises a multilayer printed circuit board, wherein the printed circuit board comprises a central processor slot and at least one group of memory slots; each group of memory slots comprise a perforative slot and at least one surface mounted slot; the surface mounted slots are formed between the perforative slots and the central processor slot; annular rings of through holes of the perforative slots are directly connected with corresponding bonding pads of the central processor slot through lead wires; and bonding pads with the same pin definition of the surface mounted slots are connected in series with the annular rings of the through holes with the same pin definition, of the perforative slots through lead wires from far to near sequentially. The computer motherboard can improve the quality of transmission signals of the lead wires between a central processor and memories.

Description

technical field [0001] The invention relates to a computer mainboard. Background technique [0002] The central processing unit of the existing computer motherboard is generally provided with two or more signal channels for communicating with the memory, and each signal channel can be connected with two or more memory slots at the same time. The memory slot of the computer motherboard generally adopts a through-hole type slot, and a plurality of memory slots are arranged side by side. [0003] Due to the use of through-hole slots, the wires between the CPU slot and the memory slot farthest away from the CPU slot must pass through the gaps between the through holes of all other memory slots, and pass through The gap space between the holes is limited, so that the wiring of the wires is crowded, causing the signals on the wires to couple and interfere with each other, and may even cause the edges of the wires to appear incomplete and make the line width uneven, resulting in t...

Claims

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Application Information

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IPC IPC(8): G06F1/18
Inventor CHEN YONGJIELI ZHENGXIANXU SHOUGUOLI SHENGJUNLIANG XIANQUANYAN XINTING
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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