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Heat pump type hot water supply apparatus

A hot water supply device and heat pump technology, which can be used in residential hot water supply systems, hot water central heating systems, heating methods, etc., and can solve problems such as inability to fully utilize various

Active Publication Date: 2014-07-23
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the refrigeration, heating and hot water supply device and its control method according to the prior art, there is a problem that the refrigerant compressed by the compressor is only used for hot water supply and air conditioning, and cannot be fully utilized in various ways.

Method used

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  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus

Examples

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Embodiment Construction

[0034] Hereinafter, embodiments of the present invention that specifically achieve the above-mentioned objects will be described with reference to the accompanying drawings. In the following description, the same names and reference numerals will be used for the same structures, and additional descriptions related thereto will be omitted.

[0035] figure 1 is a schematic diagram showing an embodiment of a heat pump type hot water supply apparatus according to the present invention, figure 2 It is a block diagram showing an embodiment of the heat pump type hot water supply apparatus according to the present invention.

[0036] The air conditioner in this embodiment includes: a refrigeration cycle 2 that enables the first refrigerant to air-condition the room; a hot water supply circuit 6 that utilizes the first refrigerant for hot water supply; and a heat storage circuit 10 , which utilizes the first refrigerant and the second refrigerant for heat storage.

[0037]The refri...

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PUM

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Abstract

There is provided a heat pump-type hot water supply apparatus including: a refrigeration cycle circuit including a compressor, an outdoor heat exchanger, expansion devices (16 and 17), and an indoor heat exchanger in which a first refrigerant is circulated and performing an air-conditioning operation; a hot water supply heat exchanger connected to the refrigeration cycle circuit to use the first refrigerant discharged from the compressor for hot water supply; a cascade heat exchanger connected to the refrigeration cycle circuit to allow the first refrigerant passing through the hot water supply heat exchanger to evaporate a second refrigerant and thereafter, to be condensed, expanded, and evaporated in the refrigeration cycle circuit; a heat storage compressor compressing the second refrigerant evaporated in the cascade heat exchanger; a heat storage tank in which the second refrigerant compressed by the heat storage compressor heats water; and a heat storage expansion device expanding the second refrigerant condensed in the heat storage tank. The apparatus can increase the heat storage temperature and additionally use the refrigerant used for hot water supply and heat storage in space air-conditioning, as a result, it is very efficient.

Description

technical field [0001] The present invention relates to a heat pump type hot water supply device, in particular to a heat pump type hot water supply device which can store heat after utilizing the heat of the refrigerant compressed in the compressor to supply the hot water. Background technique [0002] Generally speaking, a heat pump uses the heating or condensation heat of a refrigerant to transfer a low temperature heat source to a high temperature, or transfer a high temperature heat source to a low temperature cooling and heating device. [0003] A heat pump includes a compressor, an outdoor heat exchanger, an expansion mechanism, and an indoor heat exchanger, and recently, a heat pump type hot water supply device has tended to be developed, which heats water with refrigerant compressed in the compressor and utilizes it for hot water supply, so that Fossil fuel consumption becomes minimal. [0004] JP2001-263857A (2001.9.26) discloses a refrigeration and heating hot wa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B29/00F25B41/06F25B41/04
CPCF24F2221/54F24D3/18F24F5/0096F24F2203/021F24D17/02Y02B30/52F24F1/0003F24D2200/31Y02B30/12
Inventor 沈智燮朴鲁马朴熙雄
Owner LG ELECTRONICS INC
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