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Granulated powder and method for producing granulated powder

A manufacturing method and powder technology, applied in the field of granulated powder and granulated powder manufacturing, can solve the problems of poor mechanical properties, high price, high operating capital, etc.

Active Publication Date: 2011-08-31
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, a kiln that can be used at a temperature above 1200°C requires a special heat-resistant structure, so not only is it expensive, but its operating capital is also high.
[0007] On the other hand, in the case of lowering the sintering temperature, problems such as lowered density of the sintered body and poor mechanical properties may occur

Method used

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  • Granulated powder and method for producing granulated powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0146] First, 2% Ni-Fe alloy powder (manufactured by EPSON ATMIX Co., Ltd., with a true density of 7.827 g / cm3) with an average particle diameter of 6 μm produced by a water spray method was prepared. 3 ) as raw material powder. In addition, the composition of the 2% Ni-Fe alloy is: C: 0.4% by weight to 0.6% by weight, Si: 0.35% by weight or less, Mn: 0.8% by weight or less, P: 0.03% by weight or less, S: 0.045% by weight or less, Ni: 1.5% by weight to 2.5% by weight, Cr: 0.2% by weight or less, Fe: the remainder.

[0147] On the other hand, as an organic binder, polyvinyl alcohol (Kuraray Co., Ltd. RS-1717), glycerin (Wako Pure Chemical Industries, Ltd.), and an alkylamine derivative (acetate) were prepared. In addition, ion-exchanged water was prepared as a solvent. The amount of solvent added was 50 g of solvent per 1 g of organic binder. Furthermore, the degree of saponification of polyvinyl alcohol was 93, and the degree of polymerization was 1700.

[0148] Next, po...

Embodiment 2~9

[0156] Except that the addition amount of glycerin was shown in Table 1, the other was the same as in Example 1, and a granulated powder was obtained.

Embodiment 10~15

[0158] Except that the addition amounts of organic amines are shown in Table 1, the others were the same as in Example 3, and granulated powder was obtained.

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Abstract

The invention provides a granulated powder and method for producing granulated powder. Disclosed is a granulated powder which includes a metal powder and an organic binder and is obtained by binding a plurality of metal particles in the metal powder to one another by the organic binder. The organic binder contains polyvinyl alcohol or a derivative thereof and a polyol. Further, the ratio of the apparent density of the granulated powder to the true density of the metal powder (a metal material constituting the metal powder) is from 20% to 50%. Further, as the polyol, glycerin is preferred, and the addition amount thereof is preferably from 0.01 to 0.2 parts by weight based on 100 parts by weight of the metal powder.

Description

technical field [0001] The present invention relates to a granulated powder and a method for producing the granulated powder. Background technique [0002] As a method of molding metal powder, there is known a compression molding method in which a mixture of metal powder and an organic binder is filled into a predetermined molding die and compressed to obtain a molded body of a predetermined shape. Degreasing the obtained molded body to remove the organic binder and sintering the sintered metal powder to become a metal sintered body. This technology is a type of powder metallurgy technology, and it has become popular in many industries in recent years because it can mass-produce metal sintered bodies with complex shapes according to the shape of the molding die. [0003] In the compression molding method, it is first necessary to fill the molding die with metal powder as much as possible without voids. Once there is a void in the molding die, this void will become a void r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/04B22F1/148
CPCB22F1/0096B22F1/148
Inventor 门村刚志
Owner SEIKO EPSON CORP
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