Semiconductor integrated circuit test device

A technology for integrated circuits and testing devices, applied in the field of semiconductor integrated circuit testing devices, can solve the problems of unfavorable cost reduction in efficiency, high-cost RF circuits, and poor prices.

Inactive Publication Date: 2011-03-30
RENESAS ELECTRONICS CORP
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, operation inspection of RF circuits is performed at high cost
When the RF circuit is determined to be a defective workpiece at this stage, it means poor efficiency in terms of price and unfavorable measures for reducing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor integrated circuit test device
  • Semiconductor integrated circuit test device
  • Semiconductor integrated circuit test device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0037] image 3 is an overall view for describing the configuration of the semiconductor integrated circuit testing device in the first embodiment according to the present invention. The semiconductor integrated circuit testing apparatus includes an IC tester 10 and a probe card 20-1.

[0038] First, the semiconductor integrated circuit 40-1 in this embodiment will be described. It is assumed that the prescaler 41 to be measured having a PLL therein is connected to the semiconductor integrated circuit testing apparatus in this embodiment. In other words, the semiconductor integrated circuit testing apparatus in this embodiment is intended to test the semiconductor integrated circuit 40-1 having the configuration described below. That is, the semiconductor integrated circuit 40-1 in this embodiment includes a plurality of input / output parts, a frequency divider 41 as a prescaler to be tested, a VCO 42, an LPF 43, and a PFD (Phase Frequency Detector) 44. Here, the PFD44, LPF4...

no. 2 example

[0060] Figure 7 is an overall view for describing the configuration of the semiconductor integrated circuit testing device in the second embodiment according to the present invention. The semiconductor integrated circuit testing apparatus includes an IC tester 10 and a probe card 20-2.

[0061] This embodiment differs from the first embodiment of the present invention in the positions of PFD28 and LPF27. That is, in the first embodiment of the present invention, the prescaler of the semiconductor integrated circuit 40-1 to be measured includes PFD44 and LPF43. However, in the present embodiment, probe card 20-2 includes PFD28 and LPF27 instead.

[0062] This means that in the present embodiment, even when the prescaler of the semiconductor integrated circuit 40-2 to be measured does not include a PLL circuit, the semiconductor integrated circuit testing method can be performed as in the first embodiment of the present invention.

[0063] First, the semiconductor integrated...

no. 3 example

[0069] Figure 8A is an overall view for describing the configuration of a semiconductor integrated circuit testing device in a third embodiment according to the present invention. This semiconductor integrated circuit testing apparatus includes an IC tester 10 and a probe card 20-3.

[0070] The present embodiment differs from the second embodiment of the present invention mainly in the connection between the outputs of the two frequency dividers 41, 25 in the circuits of the probe cards 20-2, 20-3 and the inputs of the IC tester 10. part. This section includes a phase comparison circuit section that compares phases of two signals with each other and outputs a signal based on the phase difference; and a conversion circuit that converts the output signal of the phase comparison circuit section into a DC voltage. That is, the probe card 20-2 in the second embodiment of the present invention includes PFD28 and LPF27 as phase comparison circuit parts, and the probe card 20-3 in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A semiconductor IC test device includes: an IC tester providing first and second control signals (CS1 / CS2) based on a condition for qualifying a prescaler of a sorted semiconductor IC; and a probe card connected to the IC tester and the semiconductor IC. The probe card includes: a VCO (Voltage Controlled Oscillator) outputting a signal with frequency f based on CS1; a reference prescaler dividing f; a power variable device providing a signal with frequency f and a power based on CS2 to the sorted prescaler; a variable phase shifter canceling phase difference based on a difference between a path length through the reference prescaler versus sorted prescaler; and a conversion circuit section converting a signal based on a phase difference between a signal with a frequency divided by the sorted prescaler and a signal outputted from the reference prescaler, into a DC voltage, which is output to the IC tester.

Description

technical field [0001] The present invention relates to a semiconductor integrated circuit testing device for testing a semiconductor integrated circuit and a semiconductor integrated circuit testing method using the semiconductor integrated circuit testing device, particularly, to a semiconductor integrated circuit testing device having a probe card and using the semiconductor integrated circuit testing device A semiconductor integrated circuit test method for a test device. Background technique [0002] In recent years, mobile communication ICs (Integrated Circuits) and RF (Radio Frequency) ICs have been highly integrated. As a result, many functional circuits such as PLL (Phase Locked Loop) frequency synthesizers and frequency conversion circuits have been incorporated into ICs. For example, in some transmitting / receiving ICs for mobile phones and receiving ICs for GPS (Global Positioning System), all functional circuits except a reference oscillator such as a TCXO (Temp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/067G01R25/00
CPCG01R31/2882G01R31/2824
Inventor 黑田秀彦
Owner RENESAS ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap