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Glue solution for surface treatment of nickel-metal hydride (NI-MH) battery plate and gum dipping device

A battery plate and nickel metal hydride battery technology, applied in the direction of alkaline storage battery electrodes, etc., can solve the problems of hard plate and easy powder drop of the plate, and achieve the effect of reducing floating powder and improving softness

Active Publication Date: 2013-02-27
江苏金赛尔电池科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using these two glues to treat the positive and negative plates has the disadvantages that the plates are easy to drop powder and the plates are hard after dipping and drying.

Method used

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  • Glue solution for surface treatment of nickel-metal hydride (NI-MH) battery plate and gum dipping device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1: the preparation steps of glue solution are as follows:

[0017] 1. Mix PTFE emulsion with a mass concentration of 60% and pure water to prepare a PTFE solution with a mass ratio of 5%;

[0018] 2. Slowly add CMC or HPMC to pure water at 60°C to prepare a 1% CMC or HPMC solution by mass;

[0019] 3. Mix PTFE solution, CMC or HPMC solution and SBR glue in proportion to prepare the glue used for plate dipping. The mass ratios of PTFE, SBR, CMC or HPMC in the glue are: 4%, 0.5% %, 0.4%.

Embodiment 2

[0020] Embodiment 2: the preparation steps of glue solution are as follows:

[0021] 1. Mix PTFE emulsion with a mass concentration of 60% and pure water to prepare a PTFE solution with a mass ratio of 12.5%;

[0022] 2. Slowly add CMC or HPMC into pure water at 60°C to prepare a 3% CMC or HPMC solution by mass;

[0023] 3. Mix PTFE solution, CMC or HPMC solution and SBR glue in proportion to prepare the glue used for plate dipping. The mass ratios of PTFE, SBR, CMC or HPMC in the glue are: 10%, 1.25% %, 1.2%.

Embodiment 3

[0024] Embodiment 3: the preparation steps of glue solution are as follows:

[0025] 1. Mix PTFE emulsion with a mass concentration of 60% and pure water to prepare a PTFE solution with a mass ratio of 20%;

[0026] 2. Slowly add CMC or HPMC to pure water at 60°C to prepare a 5% CMC or HPMC solution by mass;

[0027] 3. Mix PTFE solution, CMC or HPMC solution and SBR glue in proportion to prepare the glue used for plate dipping. The mass ratios of PTFE, SBR, CMC or HPMC in the glue are: 16%, 2 %,2%.

[0028] Such as figure 1 As shown, the dipping device includes a dipping tank 3, a fixed shaft 1 and a magnetic stirrer 6, the magnetic stirrer 6 is installed below the dipping tank 3, and the rotor 5 of the magnetic stirrer 6 is installed at the bottom of the dipping tank 3, a set The fixed shaft 1 of the battery pole plate is installed in the dipping tank 3 .

[0029] When working, put the glue solution 4 in the dipping tank 3, and the pole plate is installed on the fixed sh...

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Abstract

The invention discloses a glue solution for surface treatment of a nickel-metal hydride (NI-MH) battery plate and a gum dipping device. The glue solution is prepared by mixing PTFE, SBR, CMC or HPMC with pure water according to a certain ratio; the gum dipping device comprises a gum dipping groove, a fixed shaft and a magnetic stirring apparatus; the magnetic stirring apparatus is arranged below the gum dipping groove; the rotator of the magnetic stirring apparatus is arranged at the bottom of the gum dipping groove; and the fixed shaft of one group of battery plates is arranged in the gum dipping groove. The glue solution in the invention can replace the glue solution used for the gum dipping of the positive and negative plates in the existing NI-MH battery dry process, can reduce the dusting powder on the surfaces of the positive and negative plates, improve the softness of the dried plates after being dipped, thereby effectively controlling the crack generated on the surface of the plates when the battery is wound, and stabilizing the battery performance and improving the service life of the battery.

Description

technical field [0001] The invention belongs to the technical field of nickel-metal hydride batteries, and in particular relates to a glue solution for treating the surface of a nickel-hydrogen battery pole plate and a glue dipping device. Background technique [0002] As we all know, in the dry manufacturing process of nickel-metal hydride batteries, after the positive and negative electrodes are made into plates, the surface of the plates needs to be dipped in glue. At present, most manufacturers use a single glue solution to treat the surface of the plate. For example, the positive electrode is dipped in 1-20% PTFE emulsion, and the negative electrode is dipped in 1-20% SBR glue solution. Using these two kinds of glue solutions to treat the positive and negative plates has the disadvantages that the plates are easy to drop powder and the plates are relatively hard after dipping and drying. Contents of the invention [0003] The object of the present invention is to pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01M4/26
CPCY02E60/124Y02E60/10
Inventor 翟大程郭道传韩能建朱瑞辉崔维中王瑞
Owner 江苏金赛尔电池科技有限公司
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