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Carrying head of electronic components

A technology of electronic components and mounting heads, which is applied to electrical components, electrical components, etc., can solve the problems of resistance and large sliding resistance of the suction nozzle shaft, and achieve the effect of rapid up and down movement.

Active Publication Date: 2010-12-08
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, with the ball circulation type spline shaft, since the sliding resistance is large when the balls circulate, there arises a problem that resistance is generated in the suction nozzle shaft 141 due to friction or vibration regardless of whether the front end of the suction nozzle 112 is make contact, the load is detected as if it had been contacted

Method used

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  • Carrying head of electronic components
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  • Carrying head of electronic components

Examples

Experimental program
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Embodiment Construction

[0025] First, an outline of an electronic component mounting apparatus using the mounting head according to the first embodiment of the present invention will be described.

[0026] Generally, electronic component mounting apparatus 1 such as figure 2 As shown, there are: a mounting head 10, which mounts the electronic components supplied by the component supply unit 3 on the substrate S conveyed and positioned by the substrate conveying path 2 extending in the left-right direction; and an X-axis moving mechanism 12 and a Y-axis moving mechanism. The mechanisms 14 move the mounting head 10 in the X direction and the Y direction, which are perpendicular to each other in the horizontal direction.

[0027] The X-axis moving mechanism 12 moves the mounting head 10 along the X-axis direction, and the Y-axis moving mechanism 14 moves the mounting head 10 integrally with the X-axis moving mechanism 12 along the Y-axis direction. 1 or 2 or more suction nozzles 10A for parts. The lo...

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PUM

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Abstract

The invention provides a carrying head of electronic components, which can realize stroke movement of suction nozzle and high accuracy carrying load control. The carrying head includes a movable part moving along the up and down direction by using the Z axis; a suction nozzle shaft capable of rotating around the axis and movably supported on the movable part; a pressuring shaft for pressing the suction nozzle shaft downward corresponding to the movable part; and a load sensor, for detecting load acted on the suction nozzle shaft when pressing is proceeded through the pressing shaft, wherein the detection shaft for making the load sensor face downward, configured offset to the suction nozzle in relative, and at the same time continuously formed on lower part of the pressing shaft, the suction nozzle shaft is connected with the load arm through bearings, and the load arm is locked with the load sensor at the same time, and the load arm is pressed by the load sensor pressed by the pressing shaft, such that the suction nozzle shaft pressing downward.

Description

technical field [0001] The present invention relates to an electronic component mounting head that performs load control when mounting an electronic component on a mounting target such as a wiring board by moving a suction nozzle up and down to suction and hold an electronic component. Background technique [0002] Generally, in an electronic component mounting head (hereinafter referred to as a mounting head), when a suction nozzle supported so as to be movable up and down relative to the mounting head absorbs and holds an electronic component from a component supply device, or transfers the held electronic component to the wiring When mounting on the substrate, load control is performed such that the electronic component is pressed downward with a predetermined load by the tip of the suction nozzle that is lowered. [0003] For example, in Patent Document 1, as in the present application figure 1 As shown, a mounting head for load control of electronic components is discl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 加藤礼贵黑田洁
Owner JUKI CORP
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