Semiconductor process equipment and O-shaped ring thereof

Abstract

The invention relates to semiconductor process equipment and an O-shaped ring thereof. The equipment is used for implementing process on a wafer and comprises a wafer seat and an O-shaped ring, wherein the wafer seat comprises a wafer seat main body, a fluid supplying unit and a bearing element. The bearing element is arranged on the bearing element. The fluid supplying unit is arranged in the wafer seat main body and provides fluid to the wafer. A channel is formed on the connecting part of the wafer seat main body and the bearing element, which is arranged on the wafer seat side of the wafer seat. The O-shaped ring is arranged in the channel. By arranging ribs, the radial strength of the O-shaped ring can be intensified, and the O-shaped ring is prevented from generating flexure in radial direction. In addition, by properly setting the ratio of the radial thickness of the main body to the radial thickness of the rib, the invention can simultaneously provide sufficient flexure-prevention and sealing effects. The rib is helpful to identify the outside surface, thereby avoiding false assembly.

Description

technical field [0001] The invention relates to an O-ring, in particular to an O-ring applied to semiconductor process equipment. Background technique [0002] refer to Figure 1a , Figure 1b , which shows a known semiconductor process equipment (plasma etching equipment) 1 for performing a process on a wafer 2 . Figure 1b for Figure 1a Enlarged view of part A in . The semiconductor process equipment 1 includes a wafer base 10 , an extended covering element 20 and a cavity 30 . The crystal seat 10 is disposed in the cavity 30 . The crystal seat 10 includes a crystal seat body 11, a fluid supply unit 13 and a carrier element 12, the carrier element 12 is arranged on the crystal seat body 11, the wafer 2 is placed on the carrier element 12, the fluid supply The unit 13 is arranged in the base body 11, and provides a fluid 3 to the wafer 2 through the carrier element 12, wherein a groove 14 is formed on the base side 15 of the base 10. The connection between the body 11...

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Problems solved by technology

However, referring to Figure 1d , as the viscose 4 will be etched by the plasma particles and wear away, it will lose its sealing effect after long-term use

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