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Avoidance pot mouth with tin retaining plate internally

A tin plate and pot mouth technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low work efficiency, easy to form virtual welding of contacts, and is not suitable for large-scale batch processing, so as to ensure adequacy and firmness. Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Avoidance pot mouth with tin retaining plate internally
  • Avoidance pot mouth with tin retaining plate internally
  • Avoidance pot mouth with tin retaining plate internally

Examples

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Embodiment Construction

[0012] like figure 1 Shown is an avoidance-type spout with a tin plate inside, the spout is a rectangular spout structure, a tin overflow spout 1 is provided on the edge of the spout, and an inward-turning spout is also provided on the edge of the spout. Folded tin shield 2. The tin overflow opening 1 is a rectangular opening with a depth of 3-6 mm.

[0013] like figure 2 As shown, there are electronic components 3 that need to be solder-free on the PCBA board 4 above the spout. In order to protect it from soldering, a tin shield 2 is provided to shield the electronic components 3 above it. , so that the electronic components 3 in this area are free from soldering.

[0014] On the PCBA board 4 outside the spout, there is no electronic component 3 or the edge of the spout where the electronic component 3 is far away from the spout is provided with a tin overflow port 1, so that the tin liquid in the spout overflows through the overflow tin port 1, When there are electronic...

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Abstract

The invention relates to a solder pot component used for tin soldering of a PCBA board, in particular to an avoidance pot mouth with a tin retaining plate internally. The pot mouth is of a rectangle mouth structure; the edge of the pot mouth is provided with a tin overflow opening and a tin retaining plate folded inward; and the tin overflow opening is a rectangle opening and has a depth of between 3 and 6mm. The avoidance pot mouth with the tin retaining plate internally has simple structure, can effectively improve the soldering efficiency, is suitable for large-scale automation production, and also effectively prevents an oxide layer on the surface layer of the tin liquor from leaving on the surface of the PCBA board so as to guarantee the quality of the soldering joint.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to an avoidance-type pot spout with a tin shield inside. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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