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Internally concave double-edge open type pot mouth with tin retaining plates

An open-type, tin-shield technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as low work efficiency, unsuitable for large-scale batch processing, and easy to form virtual soldering of contacts, etc., to ensure sufficiency and firmness Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Internally concave double-edge open type pot mouth with tin retaining plates
  • Internally concave double-edge open type pot mouth with tin retaining plates
  • Internally concave double-edge open type pot mouth with tin retaining plates

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Embodiment Construction

[0012] Such as figure 1 Shown is a double-sided opening type spout with an inner concave tin stopper. The spout has a rectangular mouth structure. A tin overflow port 1 is provided on the opposite side of the edge of the spout. An annular tin baffle 2 is arranged inside the opening. The solder overflow opening 1 is a rectangular gap with a depth of 3-6 mm.

[0013] Such as figure 2 As shown, the electronic components 3 on the PCBA board 4 above the solder overflow port 1 need to be shallow soldered or do not need to be soldered. By setting the depth of the solder overflow port 1, the tin liquid can flow out of the solder overflow port 1 in advance to control welding In order to prevent the surrounding tin liquid from spreading to the electronic component 3, the ring-shaped tin baffle 2 is provided to stop the tin liquid on the periphery of the ring-shaped tin baffle 2 on the ring-shaped tin baffle 2 to ensure the ring-shaped tin stop The welding effect of the electronic compon...

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Abstract

The invention relates to a solder pot component used for tin soldering of a PCBA board, in particular to an internally concave double-edge open type pot mouth with tin retaining plates. The pot mouth is of a rectangle mouth structure; the opposite sides of the edges of pot mouth are respectively provided with tin overflow openings; the circular tin retaining plates are respectively arranged in the pot mouth of the tin overflow openings; and the tin overflow openings are rectangle openings and have a depth of between 3 and 6mm. The internally concave double-edge open type pot mouth with the tin retaining plates has simple structure, can effectively improve the soldering efficiency, is suitable for large-scale automation production, and also effectively prevents an oxide layer on the surface layer of the tin liquor from leaving on the surface of the PCBA board so as to guarantee the quality of the soldering joint.

Description

Technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a double-sided opening type spout with an inner concave tin baffle plate. Background technique [0002] Normal wave soldering usually uses manual operation, and the production efficiency is relatively low. For PCBA boards that need to be soldered more densely, this soldering method is even more inadequate. In addition, because the tin outlet is too small (generally 2 mm long), it will bring The tin slag blocks the mouth of the pot, resulting in a large area of ​​false welding; for PCBA boards with dense soldering points, the mouth structure is also used, but the usual tin furnace mouth is flat. In order to achieve the PCBA board For soldering operations, it is generally necessary to maintain a distance between the PCBA board and the mouth of the pot. On the one hand, it is necessary to ensure that the tin liquid sprayed from the mouth of the pot can solder the e...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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