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Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same

A composition and heat-sensitive technology, which can be used in the photoplate-making process of patterned surface, photosensitive materials used in photomechanical equipment, printing plate preparation, etc., can solve the problem of insufficient solvent resistance, inability to completely decompose ether compounds, active ethers, etc. Problems such as large molecular weight of compounds

Inactive Publication Date: 2012-11-07
GUANGXI YULIN JINLONG PS PLATE PRINTING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of this high acid hydrolysis activity inhibitor / solvent also brings some disadvantages to the plate.
Since the etherification matrix used in the past is a novolac resin with a molecular weight of 2000-4000, when the etherification rate of the hydroxyl group in the resin is greater than 50%, although it has a high solvent resistance, the sensitivity is not high. Once the exposure amount is insufficient , the ether compound cannot be completely decomposed, and it is easy to leave a dirty bottom during the development process; when the etherification rate is less than 20%, the solvent resistance is insufficient, and the image is prone to film loss during the development process
Due to the incomplete etherification of the parent phenolic resin, a considerable amount of phenolic hydroxyl groups remain in the molecules of this highly acidolytically active etherified product. Some phenolic resins have strong acidic hydroxyl groups, resulting in a decrease in the storage stability of the solvent-inhibiting / promoting solvent itself.
In addition, the molecular weight of active ether compounds is large, which also brings some troubles to the plate coating process

Method used

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  • Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same
  • Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same
  • Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0082] The plate base used in Examples 1-6 is obtained by using the Positive PS plate production line, and the 0.3mm aluminum plate is obtained through mechanical roughening → electrolytic roughening → anodic oxidation → sealing treatment → washing and drying, and its R a The value is 0.58μm, R h (R z ) value is 2.8μm, and the amount of oxide film is 3.0g / m 2 . The sealing fluid used was prepared by dissolving 100 kg of potassium dihydrogen phosphate and 1.4 kg of potassium fluoride in 1 cubic meter of deionized water. The length of the sealing groove is 3 meters, and the temperature of the sealing liquid is 60°C. The treated plate base is directly sent to the extrusion coating section for coating, and the coating head adopts a closed extrusion coating head. By controlling the flow rate of the metering pump and the gap width of the extrusion nozzle of the coating head, the coating amount (in terms of solid content) is controlled at 1.6-1.8g / m 2 . After being leveled by t...

Embodiment 7

[0084] Change 50% of the potassium dihydrogen phosphate in the sealing solution of Examples 1 to 5 to monosodium tartrate of the same weight, while 50% of the potassium dihydrogen phosphate and all potassium fluoride remain; Base treatment, plate coating and drying process are the same as in Example 1. A non-preheated positive working thermal CTP plate WLTP-7 was obtained.

Embodiment 8

[0086] Replace 50% of the potassium dihydrogen phosphate in the sealing solution of Examples 1 to 5 with an equivalent amount of sodium silicate, while 50% of the potassium dihydrogen phosphate and all of the potassium fluoride are retained; the composition of the thermosensitive composition and the substrate Treatment, plate coating and drying process are the same as in Example 2. A non-preheated positive working thermal CTP plate WLTP-8 was obtained.

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Abstract

The invention relates to a sensible heat composition for a thermosensitive CTP (Computer to Plate) plate. The thermosensitive composition comprises a perether compound of one or more low molecular phenolic compounds as a dissolution inhibitor or a solutizer, and the molecular weight of the low molecular phenolic compound is 100-400. Furthermore, the invention also relates to a method for preparing the positive thermosensitive CTP plate without preheating. The method comprises the following steps of: (1) sequentially carrying out rough treatment, anodic oxidation treatment and sealing treatment on an aluminum plate base; (2) carrying out plate coating on the aluminum plate base through the sealing treatment by using the thermosensitive CTP (Computer to Plate) plate; (3) carrying out two-section drying on the coated aluminum plate base obtained in the step (2), wherein the first section is dried by using a far infrared ray to heat, while the second section is dried by using forced hot blast, thereby obtaining the positive thermosensitive CTP plate without preheating. The plate produced in the invention has favorable appearance, higher sensitivity, favorable development latitude and higher print run and can be used in cooperation with photographic developers universally utilized at home and abroad.

Description

technical field [0001] The invention relates to a heat-sensitive composition for positive non-preheating heat-sensitive CTP plates. Specifically, the present invention relates to a vinyl·C compound containing low molecular weight monohydric, dihydric or polyhydric phenolic compounds. 1 -C 6 The etherified product obtained by the etherification of alkyl ether or 2,3-dihydropyran is used as a heat-sensitive composition for a positive-working heat-sensitive CTP plate without preheating as a solvent-inhibiting / promoting solvent. In addition, the present invention also relates to a method for preparing a positive-working non-preheating thermal CTP plate using the heat-sensitive composition for a positive-working non-preheating thermal CTP plate. Background technique [0002] PS version (Presensitized Offset Plates) is a pre-coated photosensitive plate, which was developed to adapt to the rapid development of lithographic printing. Because PS version itself has the characterist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/033G03F7/09G03F7/38G03F7/26B41C1/10
Inventor 余尚先钟克西蒋翔宇杨琰顾江楠杨金瑞宁国光谢健
Owner GUANGXI YULIN JINLONG PS PLATE PRINTING MATERIAL
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