Pressure-adjustable mechanical arm

Abstract

The invention relates to a carrying mechanical arm, in particular to a crystal particle carrying mechanical arm which is used in a crystal particle sorting machine or a solid crystal machine and can adjust downward pressure to crystal particles. The mechanical arm consists of a back arm, a supporting plate, an elastic piece, a front arm, a pressure adjusting rod, a pressure adjusting nut, a spring, a vacuum suction nozzle and a vacuum suction nozzle joint. The supporting plate is fixed above the back arm. The elastic piece is fixed at the front end of the back arm, and simultaneously the frontend of the elastic piece is fixed with the front arm. The front end of the front arm is provided with a vacuum suction nozzle fast-removing structure comprising the vacuum suction nozzle and the vacuum suction nozzle joint. An extension at the back part of the front arm can pass through an opening at the front end of the back arm. The back end of the extension at the back part of the front arm isconnected and fixed with the pressure adjusting rod which passes through a hole on the supporting plate and can freely slide in the hole. The pressure adjusting rod is thread-connected with the pressure adjusting nut. Simultaneously, the spring passes through the pressure adjusting rod and is supported on the supporting plate, and the pressure adjusting nut is supported by taking advantage of theforce of the spring. The mechanism of the pressure-adjustable mechanical arm has the advantages of simple and clear structure, convenient adjustment and free movement, achieves economic benefits andhas an industrial production value.

Description

Technical field [0001] The invention relates to a handling mechanical arm, in particular to a crystal grain handling mechanical arm which can be used in a crystal sorter or a die bonder, which can adjust the downward pressure on the crystal grains. Background technique [0002] In the production process of light-emitting diode dies, a whole wafer is first produced. After cutting, the wafer is divided into independent dies that are completely separated from each other, and are independently adhered to the viscous blue film. In the subsequent wafer sorting process, the die sorting machine needs to use a vacuum suction nozzle device to suck the die from the blue film and place it in the specified position; or in the subsequent die bonding process, the die bonder needs to use a The vacuum suction nozzle device sucks the die from the blue film and places it in a specified position; this action requires the use of a die handling mechanical arm mechanism to complete. The patent applica...

AI Technical Summary

Problems solved by technology

The structure of the above die pick-and-place arm has certain practical value and adjustment ability, but there are still some shortcomings to be improved: 1. The movement is not smooth and accurate; 2. The structure is complex, the failure rate is high, and it is not in line with economic benefits; 3. The components Complicated and inconvenient to adjust

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