Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mainboard module array

A motherboard and array technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as non-shareability

Inactive Publication Date: 2010-02-10
INVENTEC CORP
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for motherboard modules of various sizes and specifications, a server with a fixed size is only suitable for configuring a motherboard module of a fixed size without sharing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mainboard module array
  • Mainboard module array
  • Mainboard module array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] figure 1 It is a perspective view of a motherboard module array according to an embodiment of the present invention. Please refer to figure 1 , the motherboard module 100 of this embodiment is suitable for being assembled in a server 50 . The server 50 includes a chassis 52 , a hard disk array 54 , a power supply 56 and a fan module 58 .

[0023] Figure 2 to Figure 4 for figure 1 A perspective view of the partial structure of the mainboard module array. Please refer to figure 2 and image 3 , the motherboard module array 100 includes at least one set of partition boards 110 ( figure 2 Take two sets of partition plates 110 as an example), a plurality of blocking members 130 assembled on the inside of the partition plates 110 ( Figure 4 One blocking member 130) and at least one motherboard module 120 ( figure 2 Take four motherboard modules 120 as an example). The partition plate 110 has a set of inwardly extending bearing rails 112 and an inwardly extendin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a mainboard module array, which is suitable to be assembled in a case of a server. The mainboard module array comprises a group of partition plates, a blocking piece and a mainboard module, wherein the partition plates are provided with a group of bearing tracks extending inwards and a blocking part extending inwards, wherein the block part is positioned at one end of the partition plates; the blocking piece is assembled on the inner sides of the partition plates, and is detachable and suitable to be assembled in different positions of the partition plates; and the mainboard module comprises a mainboard comprising a plurality of components and a removable tray for bearing the mainboard, and the removable tray is arranged on the bearing track and leans against the blocking piece. The blocking piece is suitable for blocking the movement of the removable tray, and the removable tray is suitable to be pulled out from the case.

Description

technical field [0001] The present invention relates to a motherboard module array, and in particular to a motherboard module array applied to a server. Background technique [0002] The server is the core computer serving each computer in the network system. It can provide functions such as disk and printing services required by network users, and also allows various clients to share various resources in the network environment with each other. The basic structure of the server is roughly the same as that of a general personal computer. It is composed of a central processing unit (CPU), a memory (Memory) and an input / output (I / O) device, and is internally connected by a bus (Bus). Connected, the central processing unit and the memory are connected through the north bridge chip, and the input / output devices are connected through the south bridge chip. According to the structure of the chassis, the server has gone through three evolutionary processes: from the early tower ch...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18
Inventor 吴剑锋杨守仁
Owner INVENTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products