Signal conduction element

Abstract

The invention discloses a signal conduction element suitable for being arranged on a circuit board, comprising an insulator, at least one first bridging line, at least one second bridging line, a plurality of first pins and a plurality of second pins, wherein the first bridging line and the second bridging line are respectively arranged on different layers of the insulator; the first pins are electrically connected with two ends of the first bridging line, while the second fins are electrically connected with two ends of the second bridging line.

Description

technical field [0001] The present invention relates to an electronic component, and in particular to a signal conducting component. Background technique [0002] With the development of electronic devices towards light, thin, small and multi-functional, the requirements for internal electronic circuits are becoming more and more complex. In order to meet the above requirements, the area of ​​circuit boards is often made smaller and smaller, and the circuits on it are more and more complicated. The denser it is, and in order to meet the multi-faceted functional requirements of electronic products, and to achieve the maximum function with the most streamlined circuit distribution, in this case, the multi-layering of circuit boards is inevitable. [0003] On the other hand, with the diversification of electronic products, circuit designers often need to make large changes to the circuit designed in the early stage due to different functional requirements in the early stage and...

AI Technical Summary

Problems solved by technology

From the common four-layer, six-layer, eight-layer of traditional circuit boards, and even increased to more than ten layers, as the number of layers increases, the operation efficiency of the circuit board decreases and the manufacturing cost increases exponentially.

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