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Printed board holding case, high frequency component, and method for producing the sames

A technology for printed substrates and manufacturing methods, applied in electrical components, mounting board safety devices, support structure installations, etc., can solve problems such as substrate shaking, substrate warping, and reduced quality and reliability of high-frequency components

Inactive Publication Date: 2009-09-02
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that it is difficult to control the bending angle of the claw in the above-mentioned claw bending processing step.
For example, when the bending angle is too small, the substrate will shake due to insufficient fixation
On the other hand, when the bending angle is too large, it will cause warping and cracking of the substrate, which in turn makes the components mounted on the substrate prone to damage.
In addition, the residual stress generated by the bending process of the claws and the force due to the difference in thermal expansion coefficient between the case and the substrate are applied to the soldered portion of the claws and the substrate, which will lead to a decrease in the quality and reliability of high-frequency components

Method used

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  • Printed board holding case, high frequency component, and method for producing the sames
  • Printed board holding case, high frequency component, and method for producing the sames
  • Printed board holding case, high frequency component, and method for producing the sames

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Embodiment Construction

[0026] Below, refer to Figure 1 to Figure 9 One embodiment of this implementation will be described. In addition, in this embodiment, the high-frequency component 10 will be described. In the case (printed circuit board storage box) 2 of the high-frequency component 10, a substrate (printed circuit board) 1 is housed, and a high-frequency component is formed on the substrate 1. circuit, but the present invention is not limited thereto.

[0027] Refer to the following figure 1 The structure of the high-frequency component 10 will now be described. figure 1 It is a perspective view for explaining the high frequency component 10 which concerns on one Embodiment of this invention. Such as figure 1 As shown, the high-frequency component 10 includes a substrate 1 and a case 2 , and the substrate 1 is accommodated inside the case 2 . The box 2 is made of an elastic metal metal frame. In addition, the substrate 1 is stored from the opening side of the metal frame of the case...

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Abstract

In a high frequency component, a case made up of metal having a shape of frame for containing a board includes tabs and stoppers. During producing of the high frequency component, the board is inserted from an opening on a side on which the tabs are provided. Each of the tabs has a height in a direction perpendicular to an insertion direction of the board, which becomes lower toward upstream in the insertion direction. Each of the tabs has elasticity so as to return to its original state after being pushed toward an inner side surface of the case by a force applied from upstream side in the insertion direction. By this, the board can be easily inserted and fixed between the tabs and the stoppers in the case. This makes it possible to provide a printed board holding case to which a printed board can be easily inserted and sufficiently fixed.

Description

technical field [0001] The present invention relates to a printed circuit board storage box, a high-frequency component including the printed circuit board storage box, and a method of manufacturing the printed circuit board storage box and the high-frequency component. The printed circuit board storage case is used to store a printed circuit board of electronic equipment such as a tuner, the electronic device has a high-frequency circuit, and the high-frequency circuit is formed on the printed circuit board. Background technique [0002] In general, in electronic equipment with high-frequency circuits such as tuners, electromagnetic shielding is used to prevent radiation of radio waves that are not intended to be radiated to other circuits, that is, so-called unwanted radiation. As a method for achieving shielding protection of such electronic equipment, for example, a method of fixing a printed circuit board on which a high-frequency circuit is mounted inside a housing of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/14
CPCH05K9/006H05K7/1417Y10T29/49208
Inventor 横山敦美
Owner SHARP KK
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