Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Probe card tester in silicon wafer characteristic test and method for counting use amount of probe card

A characteristic test and probe card technology, which is applied to the components of electrical measuring instruments, measuring electronics, and measuring devices, can solve problems such as waste, affecting test results, and inaccurate counting of probe cards, so as to improve management level, Effectively monitor the effect of usage status

Active Publication Date: 2009-05-27
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF0 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to inaccurate counting of the probe card usage, and the probe card has a certain service life. If the use of the probe card exceeds the service life, it will affect the test effect; Life is replaced, and it will cause waste

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Probe card tester in silicon wafer characteristic test and method for counting use amount of probe card
  • Probe card tester in silicon wafer characteristic test and method for counting use amount of probe card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The probe card tester in the wafer characteristic test of the present invention includes a probe card usage database and a test condition database, the probe card usage database includes probe card model information, and corresponds to the probe card model The cumulative usage information; the test condition database contains the probe card model information, and the information of various test conditions corresponding to the probe card model information, and the information corresponding to the various test condition information The information on the single use amount of the probe card under the test condition; the probe card usage database and the test condition database are related to each other through the probe card model information.

[0015] The probe card usage database also includes information on the service life of the probe card corresponding to the probe card model.

[0016] The test condition database also includes product category information, and the pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a probe card tester in a wafer property test. The tester comprises a probe card usage database and a test condition database which are associated through information of the probe card type. The invention also discloses a method for counting the usage of the probe card in the wafer property test by utilizing the probe card tester; the tester obtains test condition information and the used probe card type information; the information of single usage of the probe card is inquired in the test condition database and is associated with the probe card usage database through the information of the probe card type so as to obtain accumulated usage information; and the accumulated usage information is stored. According to practical using condition, the tester objectively counts the use times of the probe card, achieves the function of effectively monitoring the use state of the probe card, and improves the management level of the probe card in automation production by matching with the regular maintenance and the service life management of the probe card.

Description

technical field [0001] The invention relates to a test device, in particular to a probe card tester in wafer characteristic test. The invention also designs a method for counting the amount of probe cards used in the wafer characteristic test. Background technique [0002] In the process of testing integrated circuit components, probes are often used to test wafers. The probes currently used are all packaged on probe cards, and the probe cards need to be replaced in time after they are used up, so that the test work can be carried out smoothly. The current counting system for probe card usage is as follows: figure 1 As shown, the system establishes a probe card consumption counting database outside the probe card tester. The database directly communicates with the probe station and receives data. The contents of the database are shown in Table 1, and the product category is preset The probe card model used and the amount used each time are used to count the actual amount ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/30G01R1/073
Inventor 戴伟
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com