Silicon substrate having flip chip projection

Abstract

The invention provides a siliceous base plate with a flip clip lug. The lot manufacturing of the siliceous base plate is conducted by utilizing the micro electromechanical process or the semiconductor process so as to manufacture the diversified and precise siliceous base plate. According to the property of the siliceous base plate and the arrangement of a guiding connection line, a photoelectricelement, a concave structure and a flip chip lug and other elements on the siliceous base plate, the invention can increase the optical effect and the radiating effect of the encapsulating structure of the photoelectric element as well as the reliability of the encapsulating structure, and simplifies the element complexity of the encapsulating structure of the photoelectric element.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 200610100967.2 with a filing date of August 4, 2006 and an invention title of "Silicon Substrate and Photoelectric Component Encapsulation Structure with Silicon Substrate". technical field [0002] The invention relates to a silicon substrate with flip-chip bumps, in particular to a photoelectric element packaging structure with a silicon substrate manufactured by micro-electromechanical technology or semiconductor technology. Background technique [0003] Light-emitting diode (light-emitting diode; LED) components belong to cold light, which has the advantages of low power consumption, long component life, no need to warm up the lamp time, and fast response speed. It is easy to make extremely small or array elements according to application requirements, so light-emitting diode elements have been widely used in indicator lights and display devices of information, communication, and consume...

AI Technical Summary

Problems solved by technology

[0005] Since the known light emitting diode packaging structure 10 needs to form the cup-shaped base 12 first, complete the packaging by molding or potting, and then integrate the individual light emitting diode packaging structures 10 on the printed circuit board 24 by surface mounting technology, the process is complicated. Difficult to mass produce

When applied to a high-power light-emitting diode packaging structure 10, the cup-shaped substrate 12 used to carry the photoelectric element 16 will affect the wavelength of the emitted light source, brightness attenuation, and even cause problems such as element burnout due to overheating.

Due to the bulky volume of the known LED packaging structure 10 and the heat dissipation requirements of the high-power LED packaging structure 10, the size and heat dissipation efficiency of the entire LED packaging structure 10 are limited.

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