Auxiliary patch block of intelligent fan for executing self-adapting environmental management

An environmental management and self-adaptive technology, applied in the field of environmental management, can solve problems such as lack of planning, affecting airflow in computer data centers, and differences in ambient temperature

Inactive Publication Date: 2008-06-11
DEGREE CONTROLS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The typical result is a somewhat haphazard layout on the raised floor, which can be disastrous due to ambient temperature differences
Sadly, the dangers of this lack of planning are not apparent until after serious reliability problems have already occurred
In addition, any changes in the computer data center due to traffic patterns, equipment changes and additions, clogged filters, failed fans, etc. will affect the heat load distribution, which in turn will affect the balanced airflow of the computer data center

Method used

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  • Auxiliary patch block of intelligent fan for executing self-adapting environmental management
  • Auxiliary patch block of intelligent fan for executing self-adapting environmental management
  • Auxiliary patch block of intelligent fan for executing self-adapting environmental management

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Embodiment Construction

[0009] This topic provides techniques for environmental control of a room, such as providing equal airflow or heat / temperature control to a room. Such environmental control is critical to the proper functioning of the room's equipment. Rooms such as semiconductor and pharmaceutical clean rooms may not be as temperature sensitive, but may have airflow requirements that are critical for containment or particle control. Heat-generating devices, such as computer components, may have to be cooled for proper operation. The technology goes one step further to provide dynamic airflow balancing and thermal management for computer data centers.

[0010] In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments have been described in sufficient detail to enable those skilled in...

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Abstract

A technique to provide well-balanced airflow in a computer data center that uses fan assisted tiles coupled to a host computer through a network. In an example embodiment, this is accomplished by disposing the fan tiles, including temperature and airflow sensors and a programmable switch to provide a Network address, in multiple locations in raised floor and ceiling of the computer data center. Further, the example embodiment includes coupling the fan tiles to the host computer through the network to control the fan tiles based on the feedback received from the temperature and airflow sensors to provide adaptive airflow balancing and thermal management in the computer data center.

Description

technical field [0001] The present invention relates generally to environmental management of rooms and, more particularly, to thermal and / or airflow management of computer data centers. Background technique [0002] Computer data centers typically include thousands of racks, each of which contains multiple computing units. The computing unit may include multiple microprocessors, each consuming approximately 250W of power. The heat dissipation of a cabinet containing such computing units can exceed 10KW. Today's computer data centers, having approximately 1000 cabinets and occupying over 30,000 square feet, require approximately 10 MW of power for the computing infrastructure. Tomorrow's 100,000 square foot computer data center may require 50MW of power for computing infrastructure. The energy required to dissipate this heat would be an additional 20MW. A large-scale computer data center of 100,000 square feet, with 5,000 10KW cabinets, will spend about $44 million ($100...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F11/00
CPCF24F2221/40H05K7/20745H05K7/20836
Inventor 拉杰什·M·耐尔
Owner DEGREE CONTROLS
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