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Glass substrate packing box

A glass substrate and packaging box technology, which is applied in the directions of transportation and packaging, packaging of fragile items, and types of packaging items, can solve the problems of high cost of packaging glass substrates of various sizes and incompatibility of packaging boxes, achieving flexible packaging, reducing cost effect

Inactive Publication Date: 2008-06-11
INNOCOM TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In order to solve the problem that the above packaging box is not compatible with packaging glass substrates of various sizes and the cost is high, it is necessary to provide a packaging box for glass substrates that is compatible with packaging glass substrates of various sizes and reduces packaging costs.

Method used

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  • Glass substrate packing box
  • Glass substrate packing box
  • Glass substrate packing box

Examples

Experimental program
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Embodiment Construction

[0020] Please also refer to figure 2 , image 3 , figure 2 It is a three-dimensional exploded schematic diagram of the first glass substrate packaging combination in which the glass substrate is packaged in a packaging box in the present invention, image 3 yes figure 2 The three-dimensional assembly schematic diagram of the glass substrate packaging combination shown. This packaging combination 2 comprises a laminated body 20 and a packing box 30 (see image 3 ). The stacked body 20 includes a separator 22 and two glass substrates 21 stacked on top of each other. The packaging box 30 includes a box body 31 , two cushioning elements 32 and a cover body 33 , the box body 31 and the cover body 33 fit and nest with each other to form an accommodating space. The stacked body 20 and the buffer member 32 are accommodated in the accommodating space formed by the box body 31 and the cover body 33 .

[0021] The spacer 22 is a rectangular plate with a buffer function, which i...

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PUM

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Abstract

The invention relates to a package box of glass substrates. The package box of the glass substrates comprises a box body and at least one buffer element, wherein the box body is provided with a bottom and a plurality of side walls, and a containing space is circled by the engagement of the bottom with a plurality of side walls. The inner surfaces of the side walls are provided with pluralities of clamping grooves, the buffer element is equipped with a plurality of locking latches, and the locking latches and the clamping grooves are in corresponding nested arrangement. Through adding the buffer element which is disposed on the inner surfaces of the side walls of the package box, the containing space of the package box is changed, thus the package box can be conveniently corresponding to glass substrates with different sizes. The package is flexible, further package box does not need to be designed again, thereby efficiently reducing costs.

Description

technical field [0001] The invention relates to a packing box, in particular to a packing box for transporting glass substrates. Background technique [0002] With the development of digital technology, liquid crystal display products have been widely used in all aspects of daily life. For LCD modules, glass substrates are like wafers in the semiconductor industry. Therefore, the LCD industry has high packaging and transportation requirements for glass substrates. [0003] Glass is a brittle material. When it is hit by an external force or dropped to the ground, it is easy to break and become unusable. In the process of manufacturing liquid crystal display panels, the transportation of glass substrates is very important. During the transportation of the glass substrate, it is susceptible to damage caused by vibration, chemical pollution, etc., and when the glass substrate rubs against the package to generate electrostatic induction, the circuit inside the glass substrate w...

Claims

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Application Information

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IPC IPC(8): B65D85/48B65D81/02
Inventor 高凤如蔡耀栋庄政道钟文凯杨弘文
Owner INNOCOM TECH SHENZHEN
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