Soldering stove with stannum-spilled port thin wall type kettle port

Abstract

The invention relates to a tinning furnace component for soldering tin on a PCB plate, in particular to a kettle spout of solder furnace, which comprises a kettle body and a tin outlet which are arranged on a kettle spout installation panel, wherein, the wall thickness of the tin outlet is 0.5 to 3mm; the wall thickness of the kettle body is 3 to 8mm; a tin overflow hole is arranged on the sidewall of the tin outlet; a bottom plate is positioned at the bottom of the kettle body; a tin inlet hole is arranged on the bottom plate; the internal threads of the tin inlet hole are connected with a hollow nut; the bottom plate and the kettle spout installation panel are fixed and screwed together via the hollow nut. The invention has the advantages that: as the tin is overflowed through the tin overflow hole, the PCB plate can be arranged at the kettle spout directly, so as to reduce the influence to the welding quality of PCB plate because of the pressure oscillation of the kettle spout; and the invention can reduce the quality drawbacks such as soldering surface diffusion and deficient welding which are generated because of the overpressure or undersize pressure when in welding; in addition, the detachable connection between the kettle spout and the kettle spout installation panel can be realized, thereby the applicability can be strengthened.

Description

technical field [0001] The invention relates to a tin furnace component used for PCB board soldering, in particular to a tin furnace spout. Background technique [0002] When the usual wave soldering adopts the spout structure to weld the PCB board above the spout, the spout of the tin furnace is designed as a flat mouth. Keep a certain distance, on the one hand to ensure that the tin liquid sprayed from the spout can weld the electrical components on the upper PCB board, and at the same time ensure that the tin liquid sprayed from the spout can be discharged from the spout in time to prevent the spout from Excessive pressure will affect the welding quality. This kind of structure requires that the PCB board and the spout maintain a relatively constant distance during the soldering process of the solder furnace. A slight change in the distance will directly affect the welding quality and have high requirements for the equipment. In addition, the spout The pressure fluctuat...

AI Technical Summary

Problems solved by technology

This kind of structure requires that the PCB board and the spout maintain a relatively constant distance during the soldering process of the solder furnace. A slight change in the distance will directly affect the welding quality and have high requirements for the equipment. In addition, the spout The pressure fluctuation of the tin liquid will also affect the welding area and welding quality

In addition, in order to ensure that the spout has a certain structural strength, the wall thickness of the spout is thicker. For the case where the electronic components on the PCB are denser, the thicker wall thickness is not convenient for the spout to be close to the PCB. The area is separated from the non-soldering area, which can cause mis-soldering or missing soldering near the edge of the spout

Images