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A sealing and pressing method of organic illuminant part and encapsulation device for this method

A technology of organic light-emitting devices and packaging equipment, which is applied in the fields of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc.

Inactive Publication Date: 2007-12-12
东莞彩显有机发光科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the current packaging methods and packaging equipment are increasingly becoming the bottleneck of OLED mass production

Method used

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  • A sealing and pressing method of organic illuminant part and encapsulation device for this method

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Embodiment 2

[0077] In Embodiment 2 of the present invention, the rear portion of the regulating valve 59 is connected to high-pressure nitrogen, and the nitrogen pressure is stronger than 15Kpa. When the chamber pressure set at step 10 in Embodiment 1 is normal pressure or a certain value of positive pressure, Nitrogen can be filled into the cavity at step 12 in the first embodiment, so that the pressure in the cavity is a higher positive pressure than that at step 10 in the first embodiment. At this time, the pressure difference between the inside and outside will also force the substrate and the back cover tightly Bonding, the glue lines are gradually pressed apart. It can then be exposed to cure.

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Abstract

The invention relates to organic electroluminescence technique filed, especially a encapsulation method of organic electroluminescence element and encapsulation equipment with the method. Back cover is superposed with base piece and then placed in a encapsulated cavity, thereinto surface of back cover which is smeared with gluewater faces the surface of base piece plating film; then, encapsulated cavity is vacuumized, and vacuum degree of encapsulated cavity is maintained within a fixed range, positioning framework of back cover or base piece is released, the two is joint under function of gravity; then, encapsulated cavity is charged, the back cover and base piece are pressed together under pressure, the gluewater is pressed evenly; at last, the gluewater is solidified, the encapsulated cavity is open, and element encapsulated is pick out. The invention can resolve problem that equality of width of glue line is poor, and affect of smoothness of clamp surface to encapsulation can be eliminated.

Description

Technical field: [0001] The invention relates to the technical field of organic electroluminescence, in particular to a method for sealing and pressing organic light emitting devices and packaging equipment used in the method. Background technique: [0002] With the development of information technology, display devices are widely used in various aspects of information science. There are two main ways of information display, namely CRT display and FPD display. The 21st century will be a period when display devices will flourish, but the general trend is that CRTs will decline slowly, while the output of flat panel display devices (FPDs) will rise rapidly. Flat-panel display light-emitting technology is a research hotspot at this stage. Organic electroluminescent display (OLED) is a low-voltage, low-power consumption, high-brightness, high-efficiency, wide-viewing angle, full-cure, full-color display, light weight, and low price. low electroluminescent devices. OLED has be...

Claims

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Application Information

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IPC IPC(8): H01L21/52H01L51/56
Inventor 赵伟明汪涛罗科杨明生刘惠森
Owner 东莞彩显有机发光科技有限公司
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