Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dustproof ventilator and electronic apparatus therewith

A ventilation device and rib technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as poor ventilation, heat dissipation effect, failure to achieve ventilation, heat dissipation effect, temperature rise of electronic products, etc.

Inactive Publication Date: 2010-11-24
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in the process of use, eddy currents are easily generated and the wind resistance increases, so that effective ventilation and heat dissipation effects cannot be achieved.
Under the development trend of light, thin, short and small in today's electronic product design, the area of ​​the side plate 100 is required to be gradually reduced, so that the size of the through holes 102 and 108 is also correspondingly reduced, which will inevitably lead to poor ventilation and heat dissipation effect, so that the temperature of the electronic product rises, thereby damaging the entire electronic product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dustproof ventilator and electronic apparatus therewith
  • Dustproof ventilator and electronic apparatus therewith
  • Dustproof ventilator and electronic apparatus therewith

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention comprises a side plate and multi ribs. On the side plate there are multi first through holes. The ribs are formed by extending the portion of side plate between any two neighboring through holes to the inside; the extending direction is not parallel with the axial lead such that the windage can be removed while keeping the dustproof effect.

Description

Dust-proof ventilation device and electronic equipment with the device 【Technical field】 The invention relates to a dust-proof ventilation device, in particular to a dust-proof ventilation device with low wind resistance. 【Background technique】 At present, the structure of most electronic products is developing towards lightness, thinness, shortness, and small size, and the internal circuit structure is also developing towards high density. Therefore, ventilation and heat dissipation of electronic products has gradually become an increasingly important issue. The design of ventilation devices for electronic products must meet the requirements of effective ventilation on the one hand, and comply with safety regulations on the other hand. It must also have the function of dust prevention while preventing foreign objects from falling in. Therefore, dense and complex ventilation devices are usually used in the design of most electronic products. Referring to FIG. 1 , it is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 江佳靖
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products