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Boiling cooling device

A boiling cooling and refrigerant technology, applied in the direction of cooling/ventilation/heating transformation, refrigerators, refrigeration components, etc., can solve the problems of performance reduction, increase of refrigerant liquid level, reduction of effective area of ​​heat dissipation part 120, etc.

Inactive Publication Date: 2005-09-21
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In particular, when the heat generating element 10 is disposed above the refrigerant tank 110 in the vertical orientation, the liquid level of the refrigerant must be raised in conjunction with this, and the effective area (condensation area) of the heat dissipation part 120 is reduced, resulting in a significant drop in performance.

Method used

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Effect test

no. 1 Embodiment approach

[0025] figure 1 , figure 2 The first embodiment of the ebullient cooling device 100 of the present invention is shown. figure 1 It is a cross-sectional view showing the ebullient cooling device 100 when the refrigerant tank 110 is positioned in the vertical direction (hereinafter referred to as "vertical direction"), figure 2 It is a sectional view showing the ebullient cooling device 100 when the refrigerant tank 110 is positioned in the horizontal direction.

[0026] The ebullient cooling device 100 is a device for cooling a heat generating body 10 such as a semiconductor element, and is composed of a refrigerant tank 110 and a heat dissipation unit 120 . In addition, each member described below is made of a copper material or a copper-based material, and the members are integrally brazed with a brazing material applied to the joint.

[0027] First, the refrigerant tank 110 is a flat container, and has a heat receiving wall (corresponding to one wall in the present inve...

no. 2 Embodiment approach

[0041] The second embodiment of the present invention is as Figure 4 , Figure 5 shown. In the second embodiment, an oil wick (corresponding to the second oil wick of the present invention) 132 is added to the first embodiment described above.

[0042] Such as Figure 4 As shown, the oil wick 132 is arranged in the lower area of ​​the refrigerant tank 110 when the two wall portions 111 and 112 are used in a vertical orientation. In addition, the oil wick 132 has a thicker porous structure (the formed pores are larger) than the oil wick 131 .

[0043] The ebullient cooling device 100 promotes the boiling of the refrigerant due to the heat generated by the heat generating element 10 and increases the circulation amount of the refrigerant. Then, the circulation resistance of the refrigerant in the heat radiation pipe 123a increases (the pressure loss of the refrigerant increases), as Figure 5 As shown, relative to the pressure PA at point A in the refrigerant tank 110 , th...

no. 3 Embodiment approach

[0049] The third embodiment of the present invention is as Figure 8 shown. In the third embodiment, the height difference h of the refrigerant liquid is reduced by the partition wall 113 compared to the above-mentioned second embodiment.

[0050] Partition wall 113 is arranged in an area above the refrigerant liquid surface in refrigerant tank 110 when the two wall portions 111 and 112 are used in a vertical orientation, penetrates oil wick 131 , and partitions the interior of refrigerant tank 110 to the upper side. and underside.

[0051] Therefore, the pressure PA of the boiling refrigerant in the refrigerant tank 110 does not act on the liquid refrigerant in the refrigerant tank 110, and the rise of the liquid level of the refrigerant in the heat dissipation part 120 (radiation pipe 123a) can be prevented, so that the heat dissipation part 120 can be enlarged. Condensation area for improved cooling performance.

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Abstract

A boiling cooler includes a refrigerant vessel for reserving refrigerant and a heat radiation unit. A heat-generating member is attached to an outer surface of one of two opposite walls of the refrigerant vessel. The heat radiation unit is mounted at an outer surface of other of the walls. A first wick arranged at an inner surface of the one of the walls extends from a lower portion of the wall to an arrangement position of the heat-generating member when the walls are vertically positioned. Refrigerant boiled and vaporized by the heat-generating member enters the heat radiation unit to be condensed and liquidated, then returning to the refrigerant vessel. The heat-generating member can be effectively cooled regardless of the position of the heat-generating member with respect to the refrigerant vessel, in the cases where the refrigerant vessel is used in the vertical direction and in a horizontal direction.

Description

technical field [0001] The present invention relates to an ebullient cooling device for cooling heating elements such as semiconductor elements by utilizing latent heat transfer caused by boiling and condensation of a refrigerant. Background technique [0002] As a conventional ebullient cooling device, for example, a device shown in JP2002-206880A is known. That is, this ebullient cooling device is composed of a refrigerant tank (refrigerant container in Patent Document 1) that is arranged horizontally in a flat shape and internally stores refrigerant, and a heat dissipation part (refrigerant tank in Patent Document 1) installed on the upper side of the refrigerant tank. Device) structure, install the heating element (semiconductor element, etc.) on the lower side of the refrigerant tank. [0003] The radiating portion is composed of two headers vertically provided above the refrigerant tank and a tube communicating with the inside of the refrigerant tank via the two heade...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B19/00F25B23/00F28D15/02F28D15/04H01L23/427H05K7/20
CPCH01L2924/0002F25B23/006F28D15/046H01L23/427F28D15/0266F25B2500/01H01L2924/00
Inventor 石井焦宫嵨则义冈本义之小仓隆史
Owner DENSO CORP
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