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Method and apparatus for picking up work piece and mounting machine

一种拾取装置、安装机的技术，应用在电气元件、电气元件、电固体器件等方向，能够解决拾取装置结构复杂等问题，达到控制过程容易、制造工艺简单化、定位操作容易的效果

Active Publication Date: 2005-02-09
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the structure of the pick-up device is usually more complicated

Method used

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  • Method and apparatus for picking up work piece and mounting machine
  • Method and apparatus for picking up work piece and mounting machine
  • Method and apparatus for picking up work piece and mounting machine

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0038] Hereinafter, the best mode of the mounting machine according to the present invention will be described with reference to the accompanying drawings.

[0039] figure 1 A perspective view showing the mounting machine 1 is shown. This mounting machine 1 is made up of pick-up device 3 and mounting device 5, and described pick-up device is used for a workpiece 9 such as a semiconductor chip is detached from an adhesive board 11 and transfers it, and described mount device is used for workpiece 9 Mounted on a component for mounting (mounted component) such as a printed circuit board 33 .

[0040] The pick-up device 3 is arranged on the upstream side of the base 37 of the mounting machine 1 (ie figure 1 the right side of the middle), and the mounting device 5 is arranged on the downstream side of the base 37 (ie figure 1 left in ). In addition, a temporary placement table 47 is provided on the base 37 at a position between the pick-up device 3 and the mounting device 5,...

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Abstract

A work piece pickup method is for sucking and holding a work piece attached on an adhesive sheet by means of a suction collet that is disposed above the work piece attached on the adhesive sheet in such a way as to be movable up and down for sucking and holding the work piece and a suction member that is disposed below the adhesive sheet in such a way as to be movable up and down so as to detach and transfer the work piece. The mothod comprises a sheet suction process for sucking and holding a lower surface of the adhesive sheet corresponding to the work piece by the suction member, and a work piece suction process for sucking and holding the work piece by the suction collet under a state in which the suction collet and the work piece are in a positional relationship spaced from each other so as to detach the work piece. A pickup apparatus and a mounting machine operate in accordance with the above method.

Description

technical field [0001] The present invention relates to a mounting machine for semiconductor chips and the like. More specifically, the present invention relates to a method and apparatus for detaching from an adhesive board a workpiece having a small thickness such as a semiconductor chip that has been sliced ​​(cut into small cubes) and attached to the adhesive board, and also relates to a A mounting machine for mounting it on a printed circuit board or the like. Background technique [0002] When mounting semiconductor chips and the like, a pick-up device for transferring a plurality of workpieces separated / peeled by dicing, such as semiconductor chips, onto an adhesive plate and picking up an adhered workpiece is generally used. [0003] Figure 11 It is a front view showing a chip pickup device in the prior art. The pick-up device 101 is composed of a suction chuck 107 disposed above an adhesive plate 111 on which a workpiece 109 is attached, and an ejecting device 11...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B32B1/00H01L21/00H01L21/50H01L21/52H01L21/68H05K13/00
CPCH01L21/67144H01L2221/68322H01L21/67132Y10S156/932Y10S438/976Y10T156/1179Y10T156/19Y10T156/1978Y10T156/1983
Inventor 铃木英利进藤修
Owner TDK CORPARATION
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