Structure and making method of flexible circuit board for ink-jet printing head

Abstract

A flexible circuit board for ink-jet print head has an improved structure for decreasing the residual stress at bending position, resulting in high reliability, precision and quality. Its preparing process includes preparing a flexible substrate, making slotted holes at the position to be bent, preparing a metal layer, etching to form electrically conductive lines, and adding the solder mask material at the position where there are slotted holes.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a flexible circuit board that can be applied to an inkjet printing head, so that in the cassette assembly manufacturing method, the bending manufacturing method can be performed more properly, and in the subsequent manufacturing method or use It can avoid problems such as damage during collision and warpage caused by residual stress. Background technique [0002] The inkjet printing head is connected with the printer through a flexible circuit board, providing its function of transmitting and receiving control signals, so as to accurately eject ink to print documents or patterns. The flexible circuit board is assembled from the side where the inkjet chip is installed on the inkjet printing head, through at least one bending at an angle of nearly 90°, and flatly attached to the adjacent side. [0003] The specifications of current flexible circuit boards can be broadly divided into two ...

AI Technical Summary

Problems solved by technology

However, due to the rigidity of the existing flexible circuit board structure, there will be residual stress at the pre-bent position, which will cause the bent angle to change automatically. Therefore, the alignment accuracy is extremely difficult during automatic assembly. Mastery, there is no guarantee that each piece of flexible circuit board can be accurately attached to the inkjet cartridge, resulting in unstable assembly quality; but if you try to increase the force of the pre-folding jig for strong folding, the , it is easy to damage or break the conductive line on the flexible circuit board, which will accidentally cause product defects

In addition, in the above-mentioned existing production method, the bend of the flexible circuit board on the inkjet cartridge is not protected by a covering layer, which will be easily damaged when the cartridge is loaded or when it is scratched; The residual stress generated during the folding process is easy to cause the warping problem of the flexible circuit board, which is not easy to overcome

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