Substrate design method and device of power module and terminal equipment

Abstract

The invention provides a substrate design method and device of a power module and terminal equipment, and belongs to the technical field of power modules. The method comprises the following steps: acquiring input parameters of a substrate for designing a power module; according to the information of the circuit topology and a pre-stored structure diagram of each basic layout unit, determining the type and the number of the basic layout units on the circuit topology; and connecting the communication paths of the graph elements of the basic layout units on the circuit topology by using a path-finding model to obtain a connection graph of the substrate of the power module. In the application, the graph theory model of the basic layout unit is defined, the relative position and the connection relation of the basic layout unit are described, the optimal communication path in each commutation network is determined on the circuit topology through the integer programming model, and the node and the interconnection edge of the line unit corresponding to each optimal communication path are established. In the process, the input of a manual layout template is not needed, and the substrate layout autonomous design of the power module is realized.

Description

technical field [0001] The present invention relates to the technical field of power modules, in particular to a substrate design method, device and terminal equipment of a power module. Background technique [0002] With the development of large-capacity new energy power generation systems and electric drive systems for electric vehicles, the demand for the power density of power modules and the flow capacity of chips is increasing. Usually, multiple chips are packaged in power modules. However, due to the high-speed switching of the chip and the parasitic inductance effect of the substrate circuit of the power module, the performance of the chip will be limited. Therefore, reducing and balancing the parasitic inductance inside the power module is very important to improve the performance and safety of the power module. [0003] With the advancement of power module technology, heterogeneous components such as snubber capacitors are integrated into the module, which can grea...

AI Technical Summary

Problems solved by technology

However, due to the high-speed switching of the chip and the parasitic inductance effect of the substrate circuit of the power module, the performance of the chip will be limited. Therefore, reducing and balancing the parasitic inductance inside the power module is very important to improve the performance and safety of the power module

[0003] With the advancement of power module technology, absorbing capacitors and other heterogeneous components are integrated into the module, which can greatly increase the power density of the power module, but also makes the substrate design of the power module more and more complicated.

Due to the wide application range and multiple power levels of power modules, it is difficult to reuse the substrate design in different application scenarios, and the existing power module substrates rely on manual design, which is time-consuming and labor-intensive.

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