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Preparation method of PCB (Printed Circuit Board) and PCB

A conductive section and core board technology, which is applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit dielectric, etc., can solve problems affecting PCB preparation, poor compatibility, poor material compatibility, etc., achieve good compatibility and eliminate signal transmission Effect, the effect of simple preparation method

Active Publication Date: 2022-03-18
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the properties of the materials used in the preparation method are generally special, and there are characteristics such as poor compatibility with existing materials and poor compatibility with existing PCB production processes, which affects the preparation of PCBs.

Method used

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  • Preparation method of PCB (Printed Circuit Board) and PCB
  • Preparation method of PCB (Printed Circuit Board) and PCB
  • Preparation method of PCB (Printed Circuit Board) and PCB

Examples

Experimental program
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Embodiment Construction

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0052] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0053] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses a preparation method of a PCB and the PCB, and the method comprises the steps: setting a first hole ring in a preset hole opening region of a specified core board; first water-absorbent resin is arranged on the face, away from the designated core plate, of the first hole ring; sequentially stacking the first core board or the first copper layer, the second water-absorbent resin, the second core board and the specified core board and then laminating to form a multi-layer board; a hole is drilled in a preset hole opening area corresponding to the multi-layer board, and through holes are formed in the multi-layer board; performing chemical copper deposition on the multi-layer board so as to enable the first water-absorbent resin and the second water-absorbent resin to absorb water, depositing a conductive layer on the hole wall of the through hole, and drying the multi-layer board; disconnecting the third conductive section from the second conductive section; or disconnecting the third conductive section from the second conductive section, and disconnecting the first conductive section from the second conductive section. The technical scheme of the invention provides the PCB preparation method capable of completely eliminating the influence of the stub on signal transmission.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a PCB and the PCB. Background technique [0002] The copper length of the invalid hole of the signal via on the PCB (usually called via stub, via stub) has a great influence on the signal integrity of the signal via. At present, the length of the stub is reduced by back drilling. If If the stub can be completely eliminated (no stub or zero stub), the influence of the stub on signal transmission can be completely eliminated. [0003] In the related art, in order to realize no stub at all, a special lamination and multiple lamination process is adopted, or a material with special properties (a plate of anti-plating material) is used to realize it. However, the properties of the materials used in the preparation method are generally special, and there are characteristics such as poor compatibility with existing materials and poor compatibility ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46H05K1/11
CPCH05K3/429H05K3/4626H05K1/116H05K2201/0104
Inventor 焦其正纪成光王洪府王小平
Owner DONGGUAN SHENGYI ELECTRONICS
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