Mold monitoring system and method

A monitoring system and mold technology, applied in the field of machinery, can solve problems such as easy missing of acceleration data, complicated calculation methods, lack of positioning sensors, etc.

Active Publication Date: 2021-11-02
施凯 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] During the actual application process, the inventor found that the above method has complex calculation methods, too much interference information leads to inaccurate calculation, lack of positioning sensors, and inability to monitor position information and acceleration data Defects such as easy deletion

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  • Mold monitoring system and method

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Embodiment Construction

[0028] The technical solution of this patent will be further described in detail below in conjunction with specific embodiments.

[0029] Such as Figure 1 to Figure 2 As shown, a mold monitoring system of the present invention includes a background system 1 arranged on a cloud server, a client 3 connected to the background system, and several movable molds 4 arranged on a mold for monitoring the movable mold 4 The monitoring device 2; wherein the mold also includes a fixed mold 5.

[0030] The monitoring device includes a control unit, a storage unit, a timer, a sensor for monitoring the movement information of the moving model, a positioning module, a storage battery for power supply, and a communication module for communicating with the background system. The monitoring device records the motion information of the moving mold in real time, and sends it to the background system regularly through the communication module; the background system analyzes the start and end time...

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Abstract

The invention discloses a mold monitoring system and method. The mold monitoring system comprises a background system, a client connected with the background system and a plurality of monitoring devices; each monitoring device comprises a communication module communicating with the background system, a control unit, a storage unit, a timer and a sensor for monitoring motion information of a movable mold; the background system analyzes the starting and ending time, the mold closing time and the piece taking time of the movable molds according to the received motion information, and counts the number of the mold closing times of the movable molds; and the motion information comprises the acceleration of the movable molds and the time corresponding to the acceleration. The mold monitoring system has the beneficial effects that the monitoring devices can record the actions of the molds and transmit the actions to a server of the cloud, then the movement starting time and the mold opening and closing time of the molds are discriminated from the actions, and then the movement starting time and the mold opening and closing time are sent to the user side, so that a manager can conveniently master production information of the molds in time and analyze the working conditions of the molds.

Description

technical field [0001] The invention relates to the mechanical field, in particular to a mold monitoring system and a method thereof. Background technique [0002] In injection molding production, in order to better monitor the working conditions of the moving mold, it usually involves the collection of motion parameters of the moving mold. At present, common monitoring equipment uses RFID or similar equipment to count mold closing, and realize preliminary monitoring through the number of mold closing times. Nothing can be done. [0003] In this regard, Chinese patent 201711243109.8 discloses a method of monitoring the motion information of the moving model, then fitting the time-acceleration curve, and obtaining relevant information by analyzing the time-acceleration curve. [0004] In the actual application process, the inventors found that the above method has defects such as complex calculation methods, inaccurate calculation caused by too much interference information...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/80
CPCB29C45/80B29C2945/76254
Inventor 施凯蒋腾立王宁
Owner 施凯
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