Systems and apparatuses for on-die memory power analytics and management
A memory and bare chip technology, used in static memory, CAD circuit design, electrical digital data processing, etc., can solve problems such as time-consuming
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[0018] A memory die may include a power distribution network (PDN) to distribute power across the memory die. For example, a memory die may include pads for receiving power from one or more power supplies or voltage sources, and power may be distributed across the die using a grid, such as resistors and conductive lines. In some cases, a memory die may experience a voltage drop between the pads of the memory die and various other components on the memory die during operation of the memory die, which may affect the performance of the components on the memory die. In some cases, it may be useful to measure or evaluate voltage drops to ensure that various components receive sufficient power across a range of operating conditions of the memory die, to predict voltages elsewhere in the pad or memory die, or for other purposes.
[0019] Therefore, it may be desirable to develop a simulation model of the die that, for example, accurately simulates the electrical response of the die a...
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