Electroplating process and device based on field of metal surface treatment

Abstract

The invention discloses an electroplating process based on the field of metal surface treatment. The electroplating process comprises the following steps: placing a pair of anodes and a plated part inan electroplating device containing an electroplating solution, wherein the pair of anodes is respectively arranged on the left and right sides of the plated part and is respectively electrically connected with the positive electrode of a power supply, and the plated part is electrically connected with the negative electrode of the power supply to serve as a negative electrode; arranging a pair of first baffles capable of performing lifting motion between the pair of anodes and close to one end of the plated part, and arranging a pair of second baffles capable of performing lifting motion between the pair of anodes and close to the other end of the plated part; when the plated part needs to be locally electroplated, enabling the upper baffles to move downwards and the lower baffles to move upwards, so that the area, needing to be electroplated, of the plated part directly faces the pair of anodes, and the area, not needing to be electroplated, of the plated part is blocked by the upper baffles and the lower baffles; and turning on a power supply to electroplate the plated part.

Description

technical field [0001] The invention belongs to the technical field of metal surface treatment, and in particular relates to an electroplating process and equipment based on the field of metal surface treatment. Background technique [0002] In the electroplating method of the prior art, since the area of ​​the plated piece is sometimes smaller than the area of ​​the anode, the thickness of the coating on the upper and lower parts of the plated piece may be uneven, especially at the upper and lower ends of the plated piece. The thickness is inconsistent with the thickness of the coating in the middle position, which affects the quality of electroplating. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention provides an electroplating process and equipment based on the field of metal surface treatment. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: an ...

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Problems solved by technology

[0002] In the electroplating method of the prior art, since the area of ​​the plated piece is sometimes smaller than the area of ​​the anode, the thickness of the coating on the upper and lower parts of the plated piece may be uneven, especially at the upper and lower ends of the plated piece. The thickness is inconsistent with the thickness of the coating in the middle position, which affects the quality of electroplating

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