Adjustable board cutting device

Abstract

The invention provides an adjustable board cutting device. The adjustable board cutting device comprises a machine base, a board sending device, a press plate alignment device and a roll shearing device, wherein the board sending device, the press plate alignment device and the roll shearing device are arranged across the machine base from a feeding inlet to a discharging outlet in sequence. The roll shearing device is composed of an upper rotary shaft and a lower rotary shaft, wherein the upper rotary shaft is sleeved with multiple upper hobs in a sliding manner, and the lower rotary shaft issleeved with multiple lower hobs in a sliding manner. Each upper hob and the corresponding lower hob are used in cooperation in a staggered manner, and a shear mouth for cutting a PCB board is formedat the position of staggered cooperation between the upper hob and the corresponding lower hob. The adjustable board cutting device is simple and reliable to use; and it is guaranteed that the PCB board cutting device can cut PCB boards of various sizes with a good cutting effect while the abrasion caused to a hob structure inside slows down, the service life of the hob structure is prolonged, the production efficiency is improved, the production yield is increased, and the production cost is reduced furthermore.

Description

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AI Technical Summary

Benefits of technology

This patented technology allows for precise control over how small pieces (PCB boards) like circuitry or components get separated during manufacturing processes. It achieves this by continuously moving up/down between rollers while keeping them aligned properly. By doing it correctly, these tiny parts will be more efficiently used compared to traditional methods such as scraping off excess material after processing. Additionally, there're certain benefits associated with this design where multiple smaller sized holes made at one location may have their own unique shape.

Problems solved by technology

The technical problem addressed by this patented solution relates to improving the efficient and high-quality production process of printed circuit (PC)boards while reducing their size requirements without compromising on quality or reliability issues associated with existing methods such as scraping off excess material from edges during processing.

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