Intelligent automatic adhesive dispensing device

Abstract

The application provides an intelligent automatic adhesive dispensing device. By connecting a dual shaft straight line module with a frame platform in driving mode and driving the frame platform to move along space X and Y axis directions, a servo motor module drives a tin cream needle cylinder to make contact with a material slice on the frame platform along the space Z axis direction, automatic adhesive dispensing of the material slice is achieved, and compared with manual or mechanical adhesive dispensing in the traditional art, the intelligent automatic adhesive dispensing device can greatly improve work efficiency and quality. Before tin dispensing work, the dual shaft straight line module drives the material slice on the frame platform to move to a position right below a detection assembly, and the detection assembly performs visual positioning on the material slice, and when adhesive dispensing treatment is completed on the whole material slice on the frame platform, the dual shaft straight line module drives the material slice to move to the position right below the detection assembly, and the detection assembly detects the material slice, collects size and position data of tin points, and sends the above data to a control assembly, and the control assembly correspondingly controls parameters of a precision pressure regulation valve according to the collected data, and thereby achieves the function of automatically adjusting the size of the adhesive points.

Description

technical field [0001] The invention relates to the field of semiconductor packaging equipment, in particular to an intelligent automatic dispensing device. Background technique [0002] With the rapid development of science and technology, semiconductor electronic devices are more and more widely used, such as semiconductor diodes, semiconductor transistors, IC packaging, etc., and the requirements for such semiconductor electronic devices are getting higher and higher, so their production process is also Getting stricter. In the prior art, in the production process of semiconductor devices, it is necessary to carry out a dispensing process on the blank, but in the prior art, manual dispensing is used, and it is easy to have more tin and less unevenness in the production process, resulting in The situation of batch products being scrapped; and the production speed of manual dispensing is slow, and the accuracy is difficult to meet the needs of customers. Contents of the ...

AI Technical Summary

Problems solved by technology

In the prior art, in the production process of semiconductor devices, it is necessary to carry out a dispensing process on the blank, but in the prior art, manual dispensing is used, and it is easy to have more tin and less unevenness in the production process, resulting in The situation of batch products being scrapped; and the production speed of manual dispensing is slow, and the accuracy is difficult to meet the needs of customers

Images