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Multi-unit combined type integrated sensor based on array arrangement

A technology of integrated sensors and array arrangement, applied in mixed readers, instruments, sensing record carriers, etc., can solve the problems of information loss and inability to know all the information of integrated sensors, etc., and achieve the effect of easy reuse

Inactive Publication Date: 2019-08-23
嘉兴勤慎智能技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, the present invention provides a multi-unit combined integrated sensor based on array arrangement, to solve the problem that when the integrated sensor used is inspected, it is impossible to know all the information of the current integrated sensor, and it also has information The problem of hidden dangers

Method used

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  • Multi-unit combined type integrated sensor based on array arrangement
  • Multi-unit combined type integrated sensor based on array arrangement
  • Multi-unit combined type integrated sensor based on array arrangement

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Embodiment Construction

[0029] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

[0030] as attached figure 1 to attach Figure 8 Shown:

[0031] The present invention provides a multi-unit combined integrated sensor based on array arrangement, including: integrated temperature and humidity sensor 1, square groove 101, circular groove 102, stainless steel square plate 2, two-dimensional code mark 201, circular Through hole A202, information tracking device 3, stainless steel square thin plate A301, stainless steel square thin plate B302, circular through hole B303, passive RFID electronic tag chip 304 and limit cylinder 4; integrated temperature and humidity sensor 1 has a square concave on the top surface of the shell Groove 101, and the depth of square groove 101 is 1 / 2 of...

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Abstract

The invention provides a multi-unit combined type integrated sensor based on array arrangement. The multi-unit combined type integrated sensor comprises an integrated temperature and humidity sensor,a passive RFID electronic tag chip and a limiting cylinder, the passive RFID electronic tag chip is arranged at the central part of the contact end surface of the stainless steel square thin plate A and the stainless steel square thin plate B; the edges of the contact end faces of the stainless steel square thin plate A and the stainless steel square thin plate B are bonded together through an adhesive. When the integrated temperature and humidity sensor is subjected to information inspection; the two-dimensional code marked by laser on the stainless steel square plate can be aligned through acode scanning tool, the name, model, production date, batch number and other information of integrated temperature and humidity sensor generating two-dimensional code identifier are read, and the information data can be quickly acquired when the integrated temperature and humidity sensor needs to be subjected to information inspection, and the problems that information is lost and cannot be tracked can be solved.

Description

technical field [0001] The invention belongs to the technical field of sensor information tracking, and more specifically relates to a multi-unit combined integrated sensor based on array arrangement. Background technique [0002] Array integrated sensor is a sensor made of silicon semiconductor integration process, so it is also called silicon sensor or monolithic integrated sensor. It is a dedicated IC that integrates sensors on one chip and can perform measurement and analog signal output functions. [0003] After the integrated sensor is produced, part of the specification information is laser engraved on the shell of the integrated sensor by a laser coding machine, but due to the limited area on the shell of the integrated sensor, it is not possible to laser engrave all the specification information of the integrated sensor on the integrated sensor Other information is recorded on the label and pasted on the reel for packaging the integrated sensor. However, when the in...

Claims

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Application Information

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IPC IPC(8): G06K7/00G01D21/02
CPCG01D21/02G06K7/0004
Inventor 牛庾鑫张辉郑晓辉
Owner 嘉兴勤慎智能技术有限公司
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