Multilayer printed circuit board and method of making multilayer printed circuit board

Abstract

The invention discloses a multilayer printed circuit board comprising a first external circuit layer, a second external circuit layer, a first reference voltage layer, a second reference voltage layerand a high-loss dielectric layer. The first reference voltage layer is arranged between the first external circuit layer and the second external circuit layer. The first reference voltage layer is used for providing a first reference voltage. The second reference voltage layer is arranged between the first reference voltage layer and the second external circuit layer. The second reference voltagelayer is used for providing a second reference voltage. The high-loss dielectric layer is arranged between and adjacent to the first reference voltage layer and the second reference voltage layer tosuppress the noise generated between the first reference voltage layer and the second reference voltage layer. The first reference voltage is different from the second reference voltage.

Description

technical field [0001] The present invention relates to a multilayer printed circuit board, more specifically, a multilayer printed circuit board capable of reducing signal distortion. Background technique [0002] In the prior art, a multilayer printed circuit board often includes a power layer for providing a circuit operating voltage and a ground layer for providing a reference ground voltage. Generally speaking, in order to provide a stable voltage conveniently, the power layer and the ground layer are designed as flat layers with larger areas. However, in this way, the power plane, the ground plane, and the dielectric layer between them can be regarded as plate capacitors, causing the power noise between the power plane and the ground plane to be transmitted through the dielectric layer, and will Noise is coupled elsewhere. Among them, high-frequency signals are greatly affected, and often cause signal distortion, resulting in a serious decline in quality. [0003] F...

AI Technical Summary

Problems solved by technology

Among them, the high-frequency signal is greatly affected, and often causes signal distortion, resulting in a serious decline in quality

[0003] For example, vias are often used in multilayer printed circuit boards to connect wires between different layers. If the power layer and the ground layer are penetrated, the power noise existing on the flat layer between the power layer and the ground layer is likely to be transmitted to the connecting column, so that the high-frequency signal transmitted on the connecting column is affected and distorted

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