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Sensor packaging structure convenient to detach, and packaging method

A packaging structure and sensor technology, which is applied in the direction of transmitting sensing components, instruments, measuring devices, etc. using an electric/magnetic device, can solve the problems of the sensor packaging structure that cannot be disassembled, the shielding effect is poor, and the utilization rate is low, and it is convenient for industrial production. , the effect of prolonging the service life and high utilization rate

Active Publication Date: 2019-05-14
青岛中物云传智能科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes an easy-to-disassemble sensor packaging structure and its packaging method. The sensor packaging structure has a simple structure, is easy to quickly disassemble and has a good shielding effect, and solves the problem that the existing sensor packaging structure cannot be disassembled, the utilization rate is low, and the shielding effect is low. bad question

Method used

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  • Sensor packaging structure convenient to detach, and packaging method
  • Sensor packaging structure convenient to detach, and packaging method
  • Sensor packaging structure convenient to detach, and packaging method

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Embodiment Construction

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] figure 1 An alternative embodiment of a sensor package that facilitates disassembly is shown.

[0040]In this embodiment, the sensor packaging structure includes: a sensor packaging unit, a molding fabric layer 5 covering the sensor packaging unit, a first conductive buckle for fixedly connecting the sensor packaging unit and the molding fabric layer 5, and a signal Outline 3.

[0041] Wherein, the sensor packaging unit includes a sensor 1 and a doubl...

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Abstract

The invention provides a sensor packaging structure convenient to detach, a packaging method and smart clothing. The sensor packaging structure comprises: a sensor packaging unit, a molding fabric layer for covering the sensor packaging unit, a first conductive buckle made of a metal material and used for fixedly connecting the sensor packaging unit with the molding fabric layer, and a signal outgoing line; the sensor packaging unit comprises a sensor and a double-layer shielding shell arranged to completely cover the sensor; one end of the signal outgoing line is connected to a wiring pin ofthe sensor, the other end of the signal outgoing line is connected to the first conductive buckle, a first positioning hole for enabling the first conductive buckle structure to pass through is formedin the double-layer shielding shell, and the first conductive buckle is non-electrically connected with the double-layer shielding shell by adhesion. The above-mentioned sensor packaging structure has a good packaging effect, not only improves the signal shielding effect and the signal acquisition accuracy, but also facilitates quick disassembly and installation, and the sensor packaging structure is recycled and reused, thereby having a high utilization rate and a wide application range.

Description

technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a sensor packaging structure and packaging method that are easy to disassemble. Background technique [0002] At present, there are various types of sensors, which are widely used in various fields. The key to the authenticity and accuracy of the sensor's collected signals lies in its anti-interference ability to external interference signals. Various sensor shielding structures have appeared at present, such as the publication number is CN2874423Y, and the patent name is "PVDF piezoelectric film rubber-based packaging strain gauge shielded by metal shielding layer". The electromagnetic interference is shielded by setting a metal shielding net outside the substrate. Improve the anti-interference performance of the sensor. Although this technology has a certain degree of shielding setting, its disadvantage is that the shielding layer does not cover the sensor wiring riv...

Claims

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Application Information

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IPC IPC(8): G01D5/12G01D11/00G01D11/24
Inventor 赵兵张联祯王平张智璠
Owner 青岛中物云传智能科技有限公司
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