Sensor packaging structure convenient to detach, and packaging method
A packaging structure and sensor technology, which is applied in the direction of transmitting sensing components, instruments, measuring devices, etc. using an electric/magnetic device, can solve the problems of the sensor packaging structure that cannot be disassembled, the shielding effect is poor, and the utilization rate is low, and it is convenient for industrial production. , the effect of prolonging the service life and high utilization rate
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[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0039] figure 1 An alternative embodiment of a sensor package that facilitates disassembly is shown.
[0040]In this embodiment, the sensor packaging structure includes: a sensor packaging unit, a molding fabric layer 5 covering the sensor packaging unit, a first conductive buckle for fixedly connecting the sensor packaging unit and the molding fabric layer 5, and a signal Outline 3.
[0041] Wherein, the sensor packaging unit includes a sensor 1 and a doubl...
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