Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and a device for transferring and testing an interlayer board card

A middle layer and board technology, applied in faulty hardware testing methods, error detection/correction, faulty computer hardware detection, etc., can solve problems such as inability to observe oscilloscope, observe signal quality, and inability to perform consistency test, etc., to improve The effect of design reliability

Pending Publication Date: 2019-04-19
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the CPU sends signals to the board, and the board feeds back to the CPU to verify the signal quality of the receiving end of the CPU. It cannot perform the PCIE Tx conformance test and PCIE Rx BER test that comply with the PCI-SIG specification, let alone

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and a device for transferring and testing an interlayer board card
  • Method and a device for transferring and testing an interlayer board card

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following describes the embodiments of the present invention in detail in conjunction with specific embodiments and with reference to the accompanying drawings.

[0034] It should be noted that all the expressions "first" and "second" used in the embodiments of the present invention are used to distinguish two entities with the same name but not the same or parameters that are not the same. See "first" and "second". "It is only for the convenience of presentation and should not be construed as a limitation to the embodiments of the present invention, and subsequent embodiments will not describe this one by one.

[0035] Based on the foregoing objective, the first aspect of the embodiments of the present invention proposes an embodiment of a method capable of performing switching and testing for different mid-level boards or different types of mid-level boards. figure 1 S...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a device for transferring and testing an interlayer board card. The interlayer board card switching method comprises the steps of welding a board card connector connected to an interlayer board card to one side of a switching circuit board; Welding a PCIE slot connected to the consistency test fixture to the other side of the switching circuit board; Arrangingwiring on the switching circuit board to enable the board card connector to be connected with the PCIE slot; And testing the consistency of the interlayer board cards by using a consistency testing jig. According to the technical scheme provided by the invention, switching and testing can be performed for different interlayer board cards or different types of interlayer board cards, so that the consistency of the interlayer board cards can be evaluated, and the design reliability of the interlayer board cards can be improved according to test feedback.

Description

technical field [0001] The present invention relates to the field of software, and more specifically, relates to a method and device for switching and testing intermediate boards. Background technique [0002] The OCP (Open Computer Project) intermediate card standard is a mezzanine card standard formulated by OCP. This standard is used to expand PCIe network cards, serial port cards, etc. in high-density servers, and can be directly connected to the motherboard for use. OCP requires less installation space than standard PCIe cards and retains the flexibility of PCIe standard cards. [0003] The PCIe connectors of the OCP middle layer cards commonly used in high-end servers can be divided into three types: OCPA, OCPB, and OCPC. The gold finger of the OCP connector is different from the standard PCIe slot, and the pin definitions corresponding to the OCP connector on the system motherboard are also different from the standard PCIE pins, but there is no complete PCIe-OCP form...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F11/22
CPCG06F11/221G06F11/2273
Inventor 任文书
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com