A fully automatic semiconductor wafer glue spraying mechanism and glue spraying equipment

A semi-conductive and fully automatic technology, applied in the direction of spraying device, can solve the problems of nozzle blockage, affecting the quality of spraying, unstable spraying situation, etc., to prevent nozzle blockage, improve spraying effect, and improve spraying efficiency.

Active Publication Date: 2020-11-24
深圳市克拉尼声学科技有限公司
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, the glue spraying condition of the current semiconductor glue spraying equipment is unstable, and the equipment is not equipped with a cleaning device, which will cause the nozzle to be blocked, resulting in poor glue spraying effect
Most glue spraying equipment can only move in a single direction, and cannot move in multiple directions, which will be limited and affect the quality of glue spraying

Method used

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  • A fully automatic semiconductor wafer glue spraying mechanism and glue spraying equipment
  • A fully automatic semiconductor wafer glue spraying mechanism and glue spraying equipment
  • A fully automatic semiconductor wafer glue spraying mechanism and glue spraying equipment

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Embodiment Construction

[0024] In order to make the present invention more obvious and understandable, the detailed description is as follows in conjunction with the accompanying drawings.

[0025] Such as figure 1 and figure 2 As shown, a fully automatic semiconductor wafer glue spraying equipment includes a frame 10, a glue spraying platform 1, a rotating disk 2, a rotary lifting drive device 3, a horizontal and vertical moving device 4, a nozzle 5 and a splash guard 6. The frame 10 is divided into upper, middle and lower layers, and the frame 10 is provided with an air suction port on the upper layer of the frame 10, and a suction cover 13 is provided on the air suction port. The suction hood 13 is arranged in a funnel shape. It can effectively absorb wind and prevent harmful substances from causing harm to the body. The upper layer of the rack 10 is also provided with an industrial computer and a driver. The glue spraying platform 1 is set on the middle layer of the frame 10, the rotating di...

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PUM

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Abstract

The invention relates to the technical field of semiconductors, in particular to a fully-automatic semiconductor wafer glue-spraying mechanism and equipment. The fully-automatic semiconductor wafer glue-spraying mechanism comprises a glue-spraying platform, a rotary disc, a rotary lifting driving device, a horizontal and vertical moving device, a nozzle and a splashing preventing cover; the rotarydisc is arranged on the glue-spraying platform, and the rotary lifting driving device is arranged at the bottom of the rotary disc and drives the rotary disc to rise, fall and rotate; the horizontaland vertical moving device is arranged on the glue-spraying platform, the nozzle is arranged on the horizontal and vertical moving device, and the horizontal and vertical moving device drives the nozzle to move horizontally and vertically; and the splashing preventing cover is matched with the rotary disc and prevents glue liquid from splashing during glue spraying. The fully-automatic semiconductor wafer glue-spraying mechanism has the beneficial effects that the nozzle can be moved in the front-back direction and in the left-right direction, and thus the glue-spraying efficiency is improved;the rotary disc can rise and fall, and thus the glue-spraying effect is improved; and the nozzle can try to conduct spraying before working, and thus plugging of the nozzle is prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a fully automatic semiconductor wafer glue spraying mechanism and glue spraying equipment. Background technique [0002] With the development of semiconductor wafer manufacturing process technology, the technical requirements for wafer glue spraying are getting higher and higher, and various semiconductor wafer glue spraying equipment are produced accordingly. However, the glue spraying condition of the current semiconductor glue spraying equipment is unstable, and the equipment is not equipped with a cleaning device, which will cause the nozzle to be blocked, resulting in poor glue spraying effect. Most glue spraying equipment can only move in a single direction, and cannot move in multiple directions, which will be limited and affect the quality of glue spraying. Contents of the invention [0003] The purpose of the present invention is to provide a fully automatic se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/04B05B12/32B05B15/80B05B15/68B05B13/02B05B14/00B05B15/50
CPCB05B12/32B05B13/0228B05B13/0415B05B14/00B05B15/50B05B15/68B05B15/80
Inventor 韩珂韩丹丹韩士双田丽玖
Owner 深圳市克拉尼声学科技有限公司
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