Engineering structure mechanical strain testing method and device capable of eliminating temperature influence
A technology of engineering structure and mechanical strain, applied in electromagnetic measurement devices, electric/magnetic solid deformation measurement, etc., to eliminate temperature effects and facilitate performance evaluation
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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other. The present invention will be further described in detail below in combination with specific embodiments.
[0034] A method for testing the mechanical strain of engineering structures that eliminates the influence of temperature, specifically comprising the following steps:
[0035] S1. Determine the relationship between the ambient temperature and the first strain of the engineering str...
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