Conductor bundle heat dissipation method for satellite standalone

Abstract

The invention provides a conductor bundle heat dissipation method for a satellite standalone. The method comprises the steps that firstly, a metal heat conduction groove is designed in a standalone frame, then heat conduction glue is weighed, a component A and a component B are evenly stirred according to the proportion of 1:1, the inner wall of the heat conduction groove is evenly coated with theglue, wires are laid, and corresponding binding and fixing are conducted; finally, silicon rubber is adopted for fixing on the wires. According to the conductor bundle heat dissipation method, effective heat dissipation of a bare wire bundle on a printed plate in the standalone is achieved, the overheating damage risk of the wires and devices is reduced, the reliability of the devices and the standalone is improved, the long-service-life requirement of a satellite is met, effective and reliable bundle splitting of the wire bundle is achieved, the wiring mode of the wire bundle is optimized, and the aim of bundling 15 wires or below in a construction requirement is achieved; the problem of poor heat dissipation performance of a bare wire bundle on a printed plate in an existing standaloneis solved, the solid foundation is provided for the power supply reliability of a whole satellite and effective loads, and the requirements for long service life and high reliability of the satelliteare met.

Description

technical field [0001] The invention relates to the technical field of research and development of satellite power supply and distribution stand-alone products, in particular to a method for dissipating heat from a wire harness for a satellite stand-alone. Background technique [0002] At present, the newly developed satellites have high requirements for long life and high reliability. The power supply and distribution stand-alone machine needs to realize the function of supplying power to the satellite platform equipment and payload, and the printed circuit of the printed circuit board cannot effectively meet the requirements, so this type of stand-alone machine often adopts a wire design, and its large current requirements and the space limitation of the stand-alone machine , leading to the large diameter of the selected wire single wire, the diameter of multiple wires bundled is thick, the heat is concentrated, and it is not easy to dissipate heat. After long-term use, it...

AI Technical Summary

Problems solved by technology

[0003] At present, the domestic satellite stand-alone basically does not take special heat dissipation measures for the wire bundles on the printed board. Generally, the application of the wire bundles and the diameter of the bundles are generally taken as a general measure.