Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Display substrate, preparation method therefor, and display device

A display substrate and display area technology, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electrical components, etc., and can solve problems such as poor display and packaging failure

Active Publication Date: 2018-08-03
BOE TECH GRP CO LTD
View PDF5 Cites 45 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the preparation process of the display substrate, cracks may appear on the packaging film layer of the display substrate during the cutting process, which may cause the failure of the packaging, resulting in poor display

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display substrate, preparation method therefor, and display device
  • Display substrate, preparation method therefor, and display device
  • Display substrate, preparation method therefor, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is illustrative only, and in no way restricts the disclosure, its application or uses. The present disclosure can be implemented in many different forms and is not limited to the embodiments described here. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that relative arrangements of parts and steps, compositions of materials, numerical expressions and numerical values ​​set forth in these embodiments should be interpreted as illustrative only and not as limiting, unless specifically stated otherwise.

[0042] "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a display substrate, a preparation method therefor and a display device. The display substrate comprises a light-emitting part which is located in a display region of the display substrate; one or more dams which are located in a non-display region of the display substrate, wherein the non-display region surrounds the display region; and a first stress absorption part which disposed under at least one dam.

Description

technical field [0001] The present disclosure relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the rapid development of display technology, people have higher and higher requirements for the performance of display products. As an important basis of a display device, a display substrate has attracted extensive attention. [0003] During the preparation process of the display substrate, cracks may appear on the encapsulation film layer of the display substrate during the cutting process, which may cause encapsulation failure and result in poor display. In the related art, trenches are prepared on the periphery of the display substrate to prevent cracks from cutting from spreading to the display area. Contents of the invention [0004] After research, the inventor found that grooves are prepared around the display substrate to prevent cracks during cutti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/32H01L51/52
CPCH10K59/35H10K59/122H10K59/8731H10K59/124H10K71/851H10K50/844H10K71/00
Inventor 张玉欣李新国吴新银程鸿飞
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products