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Mobile phone circuit board design method, mobile phone circuit board and mobile phone

A design method and circuit board technology, applied to the structure of telephones, etc., can solve problems affecting user experience and high temperature on the side of the mobile phone

Inactive Publication Date: 2018-01-09
NUBIA TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the main board of the existing mobile phone is set on the side of the mobile phone, which causes the temperature of the side of the mobile phone to be too high and affects the user experience. To solve this technical problem, a mobile phone is provided Circuit board design method, mobile phone circuit board and mobile phone

Method used

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  • Mobile phone circuit board design method, mobile phone circuit board and mobile phone
  • Mobile phone circuit board design method, mobile phone circuit board and mobile phone
  • Mobile phone circuit board design method, mobile phone circuit board and mobile phone

Examples

Experimental program
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no. 1 example

[0063] figure 2 The basic flowchart of the mobile phone circuit board design method provided in this embodiment, the mobile phone circuit board includes a circuit substrate, a peripheral circuit module and a main control module, and the peripheral circuit module and the main control module are arranged on the circuit substrate. And the mutual communication is realized through the wires on the circuit substrate. The mobile phone circuit board design method includes:

[0064] S201. Set a first installation area on a circuit substrate.

[0065] Wherein, the first installation area is mainly used for peripheral circuit modules, and the peripheral circuit modules refer to circuits or components that generate the least heat or even no heat in the mobile phone circuit, and specifically include the following circuits or devices: radio frequency Circuits, auxiliary components, audio input and output circuits, etc., these circuits are all soldered on the first installation area set a...

no. 2 example

[0079] image 3 The detailed flowchart of the mobile phone circuit board design method provided by the second embodiment of the present invention. In this embodiment, the method of this embodiment will be described in detail below by taking the design of an "E" mobile phone circuit board as an example. The mobile phone circuit board Design methods include:

[0080] S301. Set the circuit board of the mobile phone into an "E" shape.

[0081] S302. Divide the "E"-shaped circuit board into at least two installation areas.

[0082] Wherein, the at least two installation areas include at least one first installation area for welding peripheral circuit modules and at least one second installation area for installing the main control module, and the first installation area must be set in The edge position of the "E"-shaped circuit board, that is, the "[" structure in "E", and the second installation area is set on the middle raised area of ​​the "E"-shaped circuit board.

[0083] S...

no. 3 example

[0091] Please refer to Figure 4 , Figure 4 It is a structural schematic diagram of a mobile phone circuit board provided by the third embodiment of the present invention. The mobile phone circuit board 4 includes: a circuit substrate 41, a peripheral circuit module 42 and a main control module 43, and the peripheral circuit module 42 and the main control module 43 is set on the circuit substrate 41, and realizes communication through the circuit lines on the circuit substrate 41, wherein:

[0092] The circuit substrate 41 includes a first installation area 411 and a second installation area 412, the first installation area 411 is used to install the peripheral circuit module 42, and the second installation area 412 is used to install the main control module 43, and when setting the second installation area 412, specifically, the second installation area 412 is set under the first installation area 411, and the distance between the second installation area 412 and the edge o...

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Abstract

The invention discloses a mobile phone circuit board design method, a mobile phone circuit board and a mobile phone. A mobile phone mainboard is disposed at the side edge, and the side edge of the mobile phone will be high in temperature due to the heat radiation of a chip, which affects user experience. The master control module is disposed at a circuit substrate in a second mounting area, wherein the distance between the circuit substrate and the side edge is larger than a first preset value, and thereby the master control module is far away from the commonly-hold area of the mobile phone, and the heat radiation source of the master control module is as close as possible to the center of the mobile phone. Consequently, the palm of a user will not contact with the center of the heat source whether the user holds the mobile phone transversely or vertically. The heat-radiating temperature at the edge of the mobile phone can be reduced, and good user experience can be provided for users.

Description

technical field [0001] The invention relates to the field of mobile terminals, and more specifically, relates to a mobile phone circuit board design method, a mobile phone circuit board and a mobile phone. Background technique [0002] With the development trend of mobile phones and other electronic products gradually turning to thin and light phones, the power consumption of chips is increasing, and the problems of heat generation and heat dissipation of electronic products are becoming more and more prominent. In order to improve the heating and heat dissipation of electronic products, most of the methods currently used are to set up a heat conduction structure to expand the heat dissipation area, spread the heat on the chip in a large area, or set the mode optimization function to stop some applications on the phone from running. . [0003] Although the above solution solves the heat dissipation problem of the chip, the heat is transmitted to the mobile phone case during...

Claims

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Application Information

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IPC IPC(8): H04M1/02
Inventor 梅钱君
Owner NUBIA TECHNOLOGY CO LTD
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