Fixture for mechanical shock test on power semiconductor module, and test method

Abstract

The invention discloses a fixture for a mechanical shock test on a power semiconductor module, and a test method. The fixture comprises a square bottom plate and four side plates, wherein the four side plates are vertical to the bottom plate and located on one side of the bottom plate respectively; sample installation holes for fixing test samples are formed in the bottom plate; the four side plates are paired in parallel to form a group respectively, wherein first fixed installation holes for X-axis directional installation on the installation table surface of a test bed are formed in the side plates of one group, and second fixed installation holes for Y-axis directional installation on the installation table surface of the test bed are formed in the side plates of the other group; third fixed installation holes for Z-axis directional installation on the installation table surface of the test bed are formed in the bottom plate. The method is a test method based on the fixture. The fixture and the test method disclosed by the invention have the advantages of being simple in structure principle, simpler and more convenient to operate, more accurate and reliable in test data, capable of effectively preventing the test samples from damages, and the like.

Description

Technical field [0001] The present invention mainly relates to the field of power semiconductor modules, and the characteristic is a tooling and test method suitable for mechanical impact testing of power semiconductor modules. Background technique [0002] In the traditional mechanical shock test, there are two test methods: [0003] The first is to use a tool with bolt holes to fix the module on the test bench. Such as Figure 1~4 As shown, the specific process is: [0004] (1) After the start, use tooling to fix the test sample on the test bench; [0005] (2) Conduct a mechanical impact test in one direction; [0006] (3) Disassemble and replace tooling; [0007] (4) Rotate the direction of the sample and re-fix the sample with tooling; [0008] (5) Carry out another direction mechanical impact test; [0009] (6) Repeat steps (1) ~ (5) until all six directions of tests are completed, that is, the test ends. [0010] The above method requires that the shape of the test sample must be squ...

AI Technical Summary

Problems solved by technology

That is, after the mechanical impact in each direction is completed, it is necessary to change the tooling and rotate the direction of the test sample, but the mechanical stress generated by the traditional tooling installation may cause damage to the sample, such as easy rupture of the module shell due to pressure

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